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BQ24105RHLRG4

Texas Instruments

BQ24105RHLRG4 by Texas Instruments

BQ24105RHLRG4 by Texas Instruments is a Power Management IC with VOLTAGE-MODE control, 1100 kHz switching frequency, and 4.5 A output current. Ideal for industrial applications requiring a compact CHIP CARRIER package with 20 terminals and PWM control technique. Operating temperature range from -40 to 85 °C makes it suitable for various power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 88,900 parts In-Stock

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Vyrian

USA . 7,381 parts In-Stock

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Digiode

USA . 3,231 parts In-Stock

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VNN

France . 3,030 parts In-Stock

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Nova Conductors

Japan . 99 parts In-Stock

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99

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Ampacity Inc.

Singapore . 1,118 parts In-Stock

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$4.500

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One Stop Electronics

USA . 657 parts In-Stock

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$6.500

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657

$6.500

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AZTECH Wire

Italy . 844 parts In-Stock

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$6.896

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Corohmni

South Africa . 380 parts In-Stock

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$7.549

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$7.549

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Parana Technologies

USA . 1,963 parts In-Stock

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$17.314

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$17.526

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DigiPath Technology Company

USA . 574 parts In-Stock

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$19.065

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$17.540

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ChromeModa Solutions

Germany . 2,903 parts In-Stock

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$19.454

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$15.952

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$19.454

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IDEA Electronic Components Group

UK . 1,931 parts In-Stock

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$19.454

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$17.509

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Perfect Parts

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Argo Parts USA

USA . 2,416 parts In-Stock

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Kepictronics

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Microchip USA

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Continental Prestige Electronics

USA . 1,189 parts In-Stock

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Corphita

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Aranea Global

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Overview

Unlock the power of efficient and reliable charging with the BQ24105RHLRG4 by Texas Instruments. As a leader in Power Management ICs, Texas Instruments delivers top-quality products that guarantee superior performance and durability. Ideal for a wide range of applications, this chip carrier with heat sink design ensures optimum functionality in industrial settings. With a maximum output current of 4.5A and adjustable threshold feature, the BQ24105RHLRG4 offers unmatched value and benefits for customers seeking high-performance power supply support circuits. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the power management IC, ensuring long-term reliability.

Surface Mount: YES

The surface mount option allows for easy and quick installation, making it suitable for various electronic devices and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this power management IC can withstand a wide range of environmental conditions, making it versatile and dependable.

Control Mode: VOLTAGE-MODE

Voltage-mode control ensures stable and efficient operation of the power management IC, providing consistent performance in regulating voltage levels.

Minimum Supply Voltage (Vsup): 4.35 V

The low minimum supply voltage requirement allows for flexibility in power input, accommodating a range of power sources and applications.

Maximum Output Current: 4.5 A

With a high maximum output current capacity, this power management IC can effectively handle power distribution, making it suitable for devices with high power demands.

Switcher Config: BUCK

The BUCK switcher configuration offers efficient voltage conversion and regulation, optimizing power efficiency and performance of the overall system.

Technical Specifications

Power Management ICs BQ24105RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

4.35 V

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.5 A

Nominal Output Voltage:

4.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1100 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ24105RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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