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BQ24081DRCTG4

Texas Instruments

BQ24081DRCTG4 by Texas Instruments

BQ24081DRCTG4 by Texas Instruments is a Power Management IC with 10 terminals, operating temperature range of -40 to 85°C. It supports power supply circuits with a min voltage of 4.5V and max current of 2mA. Ideal for industrial applications requiring compact design and high efficiency.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 274 parts In-Stock

1+ parts

$2.980

100+ parts

$1.600

1k+ parts

$0.973

10k+ parts

$0.934

274

$2.980

$1.600

$0.973

$0.934

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,934 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

-

3,934

$2.004

-

-

-

Vyrian

USA . 4,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,430

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 274 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$1.790

-

-

-

Semicontronic

India . 274 parts In-Stock

1+ parts

$1.790

100+ parts

$1.745

1k+ parts

$1.736

10k+ parts

-

274

$1.790

$1.745

$1.736

-

Corphita

USA . 3,816 parts In-Stock

1+ parts

$1.899

100+ parts

-

1k+ parts

-

10k+ parts

-

3,816

$1.899

-

-

-

Component Stockers USA

USA . 268 parts In-Stock

1+ parts

$2.080

100+ parts

$1.500

1k+ parts

-

10k+ parts

-

268

$2.080

$1.500

-

-

Corohmni

South Africa . 393 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

-

10k+ parts

-

393

$2.110

-

-

-

Parana Technologies

USA . 1,294 parts In-Stock

1+ parts

$14.886

100+ parts

-

1k+ parts

$15.316

10k+ parts

-

1,294

$14.886

-

$15.316

-

DigiPath Technology Company

USA . 326 parts In-Stock

1+ parts

$16.391

100+ parts

$15.080

1k+ parts

-

10k+ parts

-

326

$16.391

$15.080

-

-

ChromeModa Solutions

Germany . 2,206 parts In-Stock

1+ parts

$16.726

100+ parts

$13.715

1k+ parts

-

10k+ parts

-

2,206

$16.726

$13.715

-

-

IDEA Electronic Components Group

UK . 2,120 parts In-Stock

1+ parts

$16.726

100+ parts

$15.890

1k+ parts

$15.053

10k+ parts

-

2,120

$16.726

$15.890

$15.053

-

Native Components

USA . 71 parts In-Stock

1+ parts

$69.674

100+ parts

-

1k+ parts

-

10k+ parts

$66.887

71

$69.674

-

-

$66.887

Northwest PG Solutions

USA . 472 parts In-Stock

1+ parts

$76.641

100+ parts

-

1k+ parts

-

10k+ parts

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472

$76.641

-

-

-

Microchip USA

USA . 1,936 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,936

-

-

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-

Overview

Unlock the power of seamless and efficient power management with Texas Instruments' BQ24081DRCTG4. This innovative Power Management IC offers unparalleled quality and reliability, ensuring optimal performance in a variety of applications. With a small outline, heat sink design and very thin profile, this versatile IC is perfect for industrial use. Experience the benefits of nickel/palladium/gold terminal finish, dual terminal position, and a maximum supply voltage of 6.5V. Trust Texas Instruments to deliver cutting-edge technology that meets your power supply needs with precision and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the Power Management IC, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy installation on printed circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, making it ideal for compact electronic devices.

No. of Terminals: 10

Having 10 terminals provides flexibility for connecting multiple components and peripherals to the Power Management IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this Power Management IC can withstand challenging thermal environments and maintain performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures functionality in both extreme cold and hot conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance for reliable connections.

Width (mm): 3 mm

The compact width of 3mm contributes to the small outline and thin profile of the Power Management IC, allowing for integration into tight spaces.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage enables efficient power management in devices that require minimal power consumption.

Maximum Supply Current (Isup): 2 mA

The low maximum supply current helps to conserve energy and ensure efficiency in power usage.

Technical Specifications

Power Management ICs BQ24081DRCTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ24081DRCTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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