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BQ21061YFPT

Texas Instruments

BQ21061YFPT by Texas Instruments

BQ21061YFPT by Texas Instruments is a Power Management IC with 20 terminals, operating temperature range of -40 to 85°C, and supply voltage from 3.15V to 5.5V. It features a grid array package style suitable for industrial applications requiring precise power supply management circuits in compact spaces.

Median Price

$3.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 47,250 parts In-Stock

1+ parts

$2.999

100+ parts

$2.477

1k+ parts

$1.339

10k+ parts

-

47,250

$2.999

$2.477

$1.339

-

DigiKey

USA . 1,428 parts In-Stock

1+ parts

$3.420

100+ parts

$2.123

1k+ parts

$1.674

10k+ parts

-

1,428

$3.420

$2.123

$1.674

-

Mouser Electronics

USA . 577 parts In-Stock

1+ parts

$3.420

100+ parts

$2.130

1k+ parts

$1.850

10k+ parts

$1.820

577

$3.420

$2.130

$1.850

$1.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 635 parts In-Stock

1+ parts

$2.849

100+ parts

-

1k+ parts

-

10k+ parts

-

635

$2.849

-

-

-

Vyrian

USA . 16,097 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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16,097

-

-

-

-

VNN

France . 1,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,204

-

-

-

-

Nova Conductors

Japan . 86 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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86

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 16,081 parts In-Stock

1+ parts

$2.550

100+ parts

-

1k+ parts

-

10k+ parts

-

16,081

$2.550

-

-

-

Corphita

USA . 787 parts In-Stock

1+ parts

$2.699

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$2.699

-

-

-

Parana Technologies

USA . 1,832 parts In-Stock

1+ parts

$18.456

100+ parts

-

1k+ parts

$18.574

10k+ parts

-

1,832

$18.456

-

$18.574

-

DigiPath Technology Company

USA . 305 parts In-Stock

1+ parts

$20.322

100+ parts

$18.696

1k+ parts

-

10k+ parts

-

305

$20.322

$18.696

-

-

IDEA Electronic Components Group

UK . 2,281 parts In-Stock

1+ parts

$20.737

100+ parts

$19.700

1k+ parts

$18.663

10k+ parts

-

2,281

$20.737

$19.700

$18.663

-

ChromeModa Solutions

Germany . 1,509 parts In-Stock

1+ parts

$20.737

100+ parts

$17.004

1k+ parts

-

10k+ parts

-

1,509

$20.737

$17.004

-

-

Corohmni

South Africa . 252 parts In-Stock

1+ parts

$23.784

100+ parts

-

1k+ parts

-

10k+ parts

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252

$23.784

-

-

-

Continental Prestige Electronics

USA . 5,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,229

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,500

-

-

-

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Lixinc

USA . 911 parts In-Stock

1+ parts

-

100+ parts

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911

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-

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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800

-

-

-

-

Argo Parts USA

USA . 317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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317

-

-

-

-

iodParts Technologies Inc.

India . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

-

-

-

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S.R.D Solutions

India . 250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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250

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-

Overview

Enhance your power management solutions with the BQ21061YFPT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers top-quality products that are reliable and efficient. This Power Management IC is perfect for a variety of applications, providing customers with a convenient and versatile solution. With its advanced features and durable construction, the BQ21061YFPT ensures optimal performance and long-lasting functionality. Invest in this innovative product today and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

This feature allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape helps optimize space on the PCB, making it efficient and compact.

Nominal Supply Voltage (Vsup): 5 V

With a stable supply voltage of 5V, this product ensures consistent and reliable performance.

No. of Terminals: 20

The ample number of terminals allow for versatile connections and compatibility with different devices.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style offers high density and precise connections, enhancing overall performance and efficiency.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

With a low operating temperature, the product is suitable for use in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This finish ensures excellent conductivity and solderability, enhancing overall reliability and performance.

Terminal Position: BOTTOM

The bottom terminal position allows for easy access and efficient PCB layout design.

Maximum Seated Height: 0.5 mm

The low seated height makes the product suitable for slim and compact applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This specific IC type ensures effective power management and protection for connected devices.

Minimum Supply Voltage (Vsup): 3.15 V

With a low minimum supply voltage, the product can operate efficiently even under low power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time prevents potential damage to the product during soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability of the product.

Temperature Grade: INDUSTRIAL

This temperature grade makes the product suitable for industrial applications with varying temperature conditions.

Terminal Form: BALL

The ball terminal form provides secure connections and high reliability in various environments.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high density connections on the PCB, optimizing space and performance.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the product has a wide voltage range for versatile applications.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and optimization based on specific requirements.

Technical Specifications

Power Management ICs BQ21061YFPT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ21061YFPT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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