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BQ2085DBTRG4

Texas Instruments

BQ2085DBTRG4 by Texas Instruments

BQ2085DBTRG4 by Texas Instruments is a Power Management IC with 38 terminals, operating b/w -20 to 85°C. It has a supply voltage range of 3-3.6V and adjustable threshold feature. This IC is commonly used in power supply support circuits due to its small outline package and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,591 parts In-Stock

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Vyrian

USA . 4,017 parts In-Stock

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4,017

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Distributors (Availability)

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Native Components

USA . 1,000 parts In-Stock

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$1.104

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$1.104

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Northwest PG Solutions

USA . 1,225 parts In-Stock

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$1.215

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$1.215

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Parana Technologies

USA . 2,338 parts In-Stock

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$2.160

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$2.674

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$2.160

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$2.674

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DigiPath Technology Company

USA . 2,361 parts In-Stock

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$2.378

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$2.188

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2,361

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ChromeModa Solutions

Germany . 5,810 parts In-Stock

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$2.427

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$1.990

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$2.427

$1.990

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

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$2.427

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$2.184

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2,077

$2.427

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Ampacity Inc.

Singapore . 1,509 parts In-Stock

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$3.500

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$3.500

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One Stop Electronics

USA . 1,177 parts In-Stock

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$3.500

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$3.500

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Semicontronic

India . 1,000 parts In-Stock

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$4.500

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$4.388

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$4.365

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$4.500

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$4.365

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AZTECH Wire

Italy . 291 parts In-Stock

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$4.911

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Corphita

USA . 522 parts In-Stock

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Corohmni

South Africa . 477 parts In-Stock

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Microchip USA

USA . 132 parts In-Stock

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Overview

Experience the power of reliable and efficient power management with the BQ2085DBTRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are essential for a wide range of applications. With its compact design and adjustable threshold feature, this product provides unmatched value and benefits to customers looking for reliable power supply support circuits. Trust Texas Instruments to provide you with the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage (Vsup): 3.3 V

Matches common voltage requirements in many electronic devices, ensuring compatibility.

No. of Terminals: 38

Provides ample connectivity options for various components, allowing for versatile circuit designs.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making the product reliable in demanding operating conditions.

Minimum Operating Temperature: -20 °C

Operates effectively in cold environments, suitable for a wide range of applications.

Width (mm): 4.4 mm

Compact size enables space-saving designs, ideal for applications with limited board space.

Minimum Supply Voltage (Vsup): 3 V

Supports a lower supply voltage, increasing flexibility in power source options for the product.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a higher supply voltage range, providing a safety margin and compatibility with various power sources.

Adjustable Threshold: YES

Allows for customization of threshold levels, offering versatility in different operating conditions.

Technical Specifications

Power Management ICs BQ2085DBTRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G38

Length:

9.7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

BQ2085DBTRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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