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BQ2083DBTG4

Texas Instruments

BQ2083DBTG4 by Texas Instruments

BQ2083DBTG4 by Texas Instruments is a Power Management IC with 38 terminals, operating at -20 to 85°C. It has a supply voltage range of 3-3.6V and features adjustable threshold. Ideal for power supply support circuits in various applications due to its small outline package and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,052 parts In-Stock

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3,052

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Digiode

USA . 496 parts In-Stock

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496

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Ampacity Inc.

Singapore . 1,641 parts In-Stock

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$2.500

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$2.500

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One Stop Electronics

USA . 1,585 parts In-Stock

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$4.500

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1,585

$4.500

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Semicontronic

India . 146 parts In-Stock

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$5.500

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$5.362

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$5.335

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146

$5.500

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$5.335

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AZTECH Wire

Italy . 892 parts In-Stock

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$8.571

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892

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Parana Technologies

USA . 2,310 parts In-Stock

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$21.948

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$22.464

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2,310

$21.948

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$22.464

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DigiPath Technology Company

USA . 834 parts In-Stock

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$24.168

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$22.234

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834

$24.168

$22.234

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ChromeModa Solutions

Germany . 6,328 parts In-Stock

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$24.661

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$20.222

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$24.661

$20.222

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IDEA Electronic Components Group

UK . 572 parts In-Stock

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$24.661

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$23.428

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$22.195

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572

$24.661

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$22.195

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Microchip USA

USA . 7,310 parts In-Stock

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Corphita

USA . 4,714 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,413 parts In-Stock

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Northwest PG Solutions

USA . 1,835 parts In-Stock

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Corohmni

South Africa . 396 parts In-Stock

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Native Components

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Overview

Unlock the power of efficient energy management with the BQ2083DBTG4 by Texas Instruments. Crafted with precision and reliability, this Power Management IC is designed for seamless integration in a variety of applications. From extending battery life to optimizing power supplies, this product offers unparalleled value and benefits. Trust in Texas Instruments to deliver cutting-edge technology that enhances performance and efficiency. Experience innovation at its finest with the BQ2083DBTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the product, making it a suitable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, enhancing the overall manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

A stable supply voltage of 3.3V ensures consistent performance and reliability of the power management IC.

No. of Terminals: 38

Having a high number of terminals allows for increased connectivity and functionality within the device, offering more flexibility in design and usage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the IC can withstand harsh operating conditions, ensuring reliable performance in various environments.

Width (mm): 4.4 mm

The compact width of 4.4 mm enables space-efficient design integration, making it suitable for applications with limited space requirements.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization and optimization based on specific application requirements, enhancing the overall performance and efficiency of the power management IC.

Technical Specifications

Power Management ICs BQ2083DBTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ2083DBTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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