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BQ2060SS-E411G4

Texas Instruments

BQ2060SS-E411G4 by Texas Instruments

BQ2060SS-E411G4 by Texas Instruments is a Power Management IC with 28 terminals, operating b/w -20 to 70°C. It supports a nominal voltage of 3.3V and has adjustable threshold feature. Ideal for power supply support circuits in various applications due to its small outline package and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,798 parts In-Stock

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Digiode

USA . 2,895 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 38 parts In-Stock

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Native Components

USA . 625 parts In-Stock

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$1.041

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$1.041

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Northwest PG Solutions

USA . 1,935 parts In-Stock

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$1.146

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One Stop Electronics

USA . 1,283 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 882 parts In-Stock

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$12.524

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Parana Technologies

USA . 1,744 parts In-Stock

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$14.018

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$14.489

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ChromeModa Solutions

Germany . 2,971 parts In-Stock

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$15.751

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$12.916

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IDEA Electronic Components Group

UK . 1,282 parts In-Stock

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$15.751

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$14.963

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$14.176

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Component Stockers USA

USA . 673 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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DigiPath Technology Company

USA . 396 parts In-Stock

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Perfect Parts

USA . 144 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Discover the power of efficient energy management with the BQ2060SS-E411G4 by Texas Instruments. Designed with top-notch quality and precision, this Power Management IC is a game-changer in its category. With a compact rectangular shape and a small outline package style, this product offers versatile applications in various industries. From maintaining a nominal supply voltage of 3.3V to providing adjustable thresholds, this IC ensures optimal performance at all times. Trust Texas Instruments for exceptional reliability and innovation, and experience the benefits of seamless power supply support with the BQ2060SS-E411G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it reliable for long-term use.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3V ensures stable and efficient power distribution within the circuit.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and can support multiple functions within the power management system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20°C ensures functionality even in cold environments.

Technical Specifications

Power Management ICs BQ2060SS-E411G4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.7 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

BQ2060SS-E411G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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