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BQ2060SS-E207-EPG4

Texas Instruments

BQ2060SS-E207-EPG4 by Texas Instruments

BQ2060SS-E207-EPG4 by Texas Instruments is a Power Management IC with 28 terminals, operating at 3.3V supply voltage. It features a small outline package shape and dual terminal position, suitable for power supply support circuits in commercial-grade applications. With a max seated height of 1.75mm and moisture sensitivity level of 2, it offers adjustable threshold and peak reflow temperature of 260°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,891 parts In-Stock

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4,891

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Vyrian

USA . 2,904 parts In-Stock

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Euro-Tech

UK . 77 parts In-Stock

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77

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One Stop Electronics

USA . 1,506 parts In-Stock

1+ parts

$0.500

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1,506

$0.500

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Native Components

USA . 913 parts In-Stock

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$0.804

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913

$0.804

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Northwest PG Solutions

USA . 1,439 parts In-Stock

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$0.884

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1,439

$0.884

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Parana Technologies

USA . 331 parts In-Stock

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$2.548

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$3.035

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331

$2.548

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$3.035

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DigiPath Technology Company

USA . 109 parts In-Stock

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$2.806

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$2.581

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109

$2.806

$2.581

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ChromeModa Solutions

Germany . 4,689 parts In-Stock

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$2.863

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$2.348

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$2.863

$2.348

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IDEA Electronic Components Group

UK . 1,938 parts In-Stock

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$2.863

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$2.577

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1,938

$2.863

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$2.577

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Ampacity Inc.

Singapore . 249 parts In-Stock

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$4.500

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249

$4.500

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AZTECH Wire

Italy . 319 parts In-Stock

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$14.795

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319

$14.795

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Component Stockers USA

USA . 563 parts In-Stock

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$99.990

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563

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Microchip USA

USA . 1,994 parts In-Stock

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Corphita

USA . 1,644 parts In-Stock

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Overview

Enhance your power management solutions with the BQ2060SS-E207-EPG4 by Texas Instruments. This high-quality Power Management IC offers reliability and precision, thanks to its cutting-edge technology and superior manufacturing standards. Ideal for a wide range of applications, this product provides outstanding performance with adjustable thresholds and multiple channels. Trust in Texas Instruments to deliver exceptional value and benefits to meet your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power Management IC, making it suitable for various environmental conditions.

Nominal Supply Voltage (Vsup): 3.3 V

The specified supply voltage ensures compatibility with a wide range of applications and devices that require a 3.3V power source.

No. of Channels: 4

Having multiple channels allows for the management of different power sources or loads simultaneously, enhancing the versatility and efficiency of the IC.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature rating ensures that the Power Management IC can withstand temperature variations without compromising performance, making it reliable in different operating environments.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization and fine-tuning of the power management functions, providing greater control over the connected devices and their power requirements.

Technical Specifications

Power Management ICs BQ2060SS-E207-EPG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.235 mA

Maximum Supply Voltage (Vsup):

3.7 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

BQ2060SS-E207-EPG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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