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BQ2057CDGKRG4

Texas Instruments

BQ2057CDGKRG4 by Texas Instruments

BQ2057CDGKRG4 by Texas Instruments is a power management IC with a supply voltage range of 4.5V to 15V. It has a small outline, thin profile package style and is suitable for power supply support circuits. With a max operating temperature of 70°C, it offers adjustable threshold and surface mount capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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VNN

France . 26,946 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

USA . 4,933 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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One Stop Electronics

USA . 1,200 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 636 parts In-Stock

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$7.477

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$7.969

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636

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Ampacity Inc.

Singapore . 202 parts In-Stock

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$7.500

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DigiPath Technology Company

USA . 1,812 parts In-Stock

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$8.233

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$7.574

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ChromeModa Solutions

Germany . 4,406 parts In-Stock

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$8.401

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$6.889

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$8.401

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IDEA Electronic Components Group

UK . 940 parts In-Stock

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$8.401

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$7.981

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$7.561

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940

$8.401

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AZTECH Wire

Italy . 844 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

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Argo Parts USA

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Overview

Texas Instruments, a leading manufacturer in the power management ICs industry, presents the BQ2057CDGKRG4. This high-quality product offers countless benefits and advantages to customers. With its compact square shape and thin profile, it provides excellent surface mount capability. The BQ2057CDGKRG4 supports power supply circuits, ensuring reliable and efficient performance. Its adjustable threshold allows for customization, while its wide operating temperature range makes it suitable for various applications. Trust Texas Instruments to deliver superior products that enhance your power management needs. Experience the value and reliability of the BQ2057CDGKRG4 today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount:

YES. The surface mount feature allows for easy installation and space-saving design, making it convenient for compact electronic devices.

Package Shape:

SQUARE. The square package shape enhances compatibility and facilitates easier integration in electronic systems.

Nominal Supply Voltage (Vsup):

5 V. With a 5V nominal supply voltage, this power management IC provides a stable power source for efficient operation.

Power Supplies (V):

4.5/15. The wide range of power supplies (4.5V to 15V) ensures compatibility with different power sources, making it versatile for use in various applications.

No. of Terminals:

8. With 8 terminals, this IC offers flexibility and connectivity for diverse circuit configurations.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH. The small outline, thin profile, and shrink pitch package style enable compact and space-efficient circuit board layouts, ideal for miniaturized devices.

Maximum Operating Temperature:

70 °C. The high maximum operating temperature of 70°C ensures reliable performance even in demanding environments.

Minimum Operating Temperature:

20 °C. The low minimum operating temperature of -20°C allows reliable operation in cold conditions, expanding the product's usability range.

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER. The use of nickel palladium gold silver terminal finish ensures excellent conductivity, corrosion resistance, and reliability.

Terminal Position:

DUAL. The dual terminal position enhances flexibility in circuit connection, enabling various circuit designs to be implemented efficiently.

Maximum Seated Height:

1.1 mm. The low maximum seated height allows for the development of compact and slim designs, particularly beneficial in space-constrained applications.

Width (mm):

3 mm. The small width of 3mm enhances the overall compactness and integration capacity of the IC.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT. This IC serves as a power supply support circuit, providing efficient and stable power management capabilities, making it suitable for power-sensitive applications.

Minimum Supply Voltage (Vsup):

4.5 V. The low minimum supply voltage of 4.5V allows for efficient operation even with low power sources.

Maximum Time At Peak Reflow Temperature (s):

30. The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during the manufacturing process, maintaining product reliability.

Peak Reflow Temperature °C:

260. The high peak reflow temperature of 260°C ensures proper soldering and secure mounting of the IC, preventing failures due to thermal stresses.

Length:

3 mm. The small length of 3mm contributes to the compactness and integration capability of the IC in space-constrained designs.

Maximum Supply Current (Isup):

4 mA. With a maximum supply current of 4mA, this IC operates with low power consumption, making it suitable for battery-powered devices.

Technology:

CMOS. The CMOS technology utilized in this IC offers low power consumption, high noise immunity, and wide operating voltage range, making it efficient and versatile.

Terminal Form:

GULL WING. The gull-wing terminal form provides easy soldering and reliable connections, ensuring secure and robust circuit connections.

Terminal Pitch:

0.65 mm. The small terminal pitch of 0.65mm allows for high-density circuit board designs, enabling efficient space utilization.

Moisture Sensitivity Level (MSL):

2. The moisture sensitivity level of 2 ensures the proper handling and storage of the IC, preventing moisture-related failures.

Maximum Supply Voltage (Vsup):

15 V. The high maximum supply voltage of 15V allows for compatibility with a wide range of power sources, offering versatility in various applications.

Adjustable Threshold:

YES. The presence of an adjustable threshold feature provides flexibility in setting voltage thresholds, allowing customization based on specific application requirements.

Technical Specifications

Power Management ICs BQ2057CDGKRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ2057CDGKRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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