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BQ2040SN-C408G4

Texas Instruments

BQ2040SN-C408G4 by Texas Instruments

BQ2040SN-C408G4 by Texas Instruments is a Power Management IC with 16 terminals, Vsup range of 3-6.5V, and adjustable threshold at +0.05V. It is used in power supply support circuits, operates b/w 0-70°C, and has a compact rectangular package ideal for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,595 parts In-Stock

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Vyrian

USA . 3,611 parts In-Stock

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VNN

France . 986 parts In-Stock

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986

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Nova Conductors

Japan . 10 parts In-Stock

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10

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One Stop Electronics

USA . 1,267 parts In-Stock

1+ parts

$4.500

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1,267

$4.500

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Parana Technologies

USA . 1,827 parts In-Stock

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$6.630

100+ parts

$615.742

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$5.967

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1,827

$6.630

$615.742

$5.967

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DigiPath Technology Company

USA . 765 parts In-Stock

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$7.301

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$6.717

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765

$7.301

$6.717

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IDEA Electronic Components Group

UK . 1,972 parts In-Stock

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$7.450

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$6.705

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1,972

$7.450

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$6.705

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ChromeModa Solutions

Germany . 1,493 parts In-Stock

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$7.450

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$6.109

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 736 parts In-Stock

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$18.014

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Microchip USA

USA . 2,721 parts In-Stock

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Corphita

USA . 2,057 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of efficient energy management with the BQ2040SN-C408G4 by Texas Instruments. Crafted with precision and quality, this Power Management IC offers unparalleled reliability and performance. Perfect for a wide range of applications in the tech industry, this product ensures optimal power supply support circuitry. With its compact design and advanced features, customers can expect seamless integration and enhanced functionality. Experience the value and benefits of superior power management with the BQ2040SN-C408G4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material makes the product easy to handle and transport.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 4.25 V

Provides a stable voltage supply for the connected components, ensuring reliable performance.

Package Style (Meter): SMALL OUTLINE

Compact design saves valuable board space and allows for denser packing of components.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, making it suitable for a variety of environments.

Minimum Operating Temperature: 0 °C

Operates efficiently in low-temperature conditions, ensuring consistent performance.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact placement on circuit boards.

Width (mm): 3.9 mm

Narrow width helps in fitting the product in space-constrained applications.

Minimum Supply Voltage (Vsup): 3 V

Can operate with lower voltage supply, providing flexibility in power source selection.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliable soldering during assembly.

Temperature Grade: COMMERCIAL

Suitable for use in standard commercial applications.

Maximum Supply Current (Isup): 0.25 mA

Low power consumption helps in minimizing energy usage.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Moisture Sensitivity Level (MSL): 2

Resistant to moisture, ensuring reliability in humid environments.

Maximum Supply Voltage (Vsup): 6.5 V

Can handle higher voltage supplies, providing a wider range of compatible power sources.

Adjustable Threshold: YES

Ability to adjust threshold voltage allows for customization based on specific requirements.

Technical Specifications

Power Management ICs BQ2040SN-C408G4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/6.5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.05V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

BQ2040SN-C408G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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