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BQ2000PWRG4

Texas Instruments

BQ2000PWRG4 by Texas Instruments

BQ2000PWRG4 by Texas Instruments is a Power Management IC with 5V nominal voltage, 8 terminals, and a compact rectangular package. It operates b/w -20 to 70°C, supports power supplies up to 6V, and features a buck switcher configuration. Ideal for applications requiring precise power management in small electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 3,907 parts In-Stock

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3,907

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Vyrian

USA . 3,840 parts In-Stock

1+ parts

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3,840

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Digiode

USA . 630 parts In-Stock

1+ parts

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630

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 849 parts In-Stock

1+ parts

$4.500

100+ parts

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849

$4.500

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One Stop Electronics

USA . 408 parts In-Stock

1+ parts

$5.500

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408

$5.500

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AZTECH Wire

Italy . 853 parts In-Stock

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$8.211

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853

$8.211

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Parana Technologies

USA . 1,022 parts In-Stock

1+ parts

$18.199

100+ parts

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$18.340

10k+ parts

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1,022

$18.199

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$18.340

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ChromeModa Solutions

Germany . 3,130 parts In-Stock

1+ parts

$20.448

100+ parts

$16.767

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3,130

$20.448

$16.767

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IDEA Electronic Components Group

UK . 1,265 parts In-Stock

1+ parts

$20.448

100+ parts

$19.426

1k+ parts

$18.403

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1,265

$20.448

$19.426

$18.403

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A-Z Elektronik GmbH

Germany . 7,401 parts In-Stock

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7,401

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Microchip USA

USA . 4,958 parts In-Stock

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4,958

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Alle Elektronik GmbH

Germany . 4,934 parts In-Stock

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4,934

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Corphita

USA . 3,665 parts In-Stock

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3,665

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DigiPath Technology Company

USA . 1,500 parts In-Stock

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$18.436

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1,500

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$18.436

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Aranea Global

USA . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 250 parts In-Stock

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250

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Overview

Experience unparalleled power management with the BQ2000PWRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products like this Power Management IC designed to optimize efficiency and performance in various applications. With its small outline and high reliability, this IC offers customers a valuable solution for their power supply support circuit needs. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and enhances your electronics projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into existing designs.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is ideal for a wide range of applications and provides stable power.

Power Supplies (V): 5

Having 5 power supplies allows for flexibility in powering various components.

No. of Terminals: 8

The 8 terminals provide multiple connection points for increased versatility.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This design style saves space on the circuit board and allows for compact designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in various environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows for use in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of high-quality finishes ensures reliable connections and long-term performance.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves reliability.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact designs and space-saving installations.

Width (mm): 3 mm

The 3mm width makes the product suitable for applications with limited space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This additional functionality supports power supply requirements and enhances overall performance.

Minimum Supply Voltage (Vsup): 4 V

The 4V minimum supply voltage accommodates a wide range of power input sources.

Maximum Time At Peak Reflow Temperature (s): 30

This feature ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures strong and reliable solder connections.

Length: 4.4 mm

The 4.4mm length makes the product suitable for compact designs and space-constrained applications.

Maximum Supply Current (Isup): 1 mA

The low supply current helps conserve power and improve efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections.

Switcher Config: BUCK

The buck switcher configuration provides efficient power conversion and regulation.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density connections and compact layouts.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 ensures reliability in humid environments.

Maximum Supply Voltage (Vsup): 6 V

The 6V maximum supply voltage provides flexibility for powering various components.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and optimization for different applications.

Technical Specifications

Power Management ICs BQ2000PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ2000PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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