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AWR6843ABSABLRQ1

Texas Instruments

AWR6843ABSABLRQ1 by Texas Instruments

Texas Instruments AWR6843ABSABLRQ1 is a MMWAVE RADAR SENSOR MODULE with 161 terminals. It operates b/w -40 to 125 °C, outputting digital voltage from 0.45-2.85V. Ideal for automotive applications due to AEC-Q100 screening and surface mount feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,324 parts In-Stock

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Digiode

USA . 4,922 parts In-Stock

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Native Components

USA . 20 parts In-Stock

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$0.880

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20

$0.880

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Northwest PG Solutions

USA . 388 parts In-Stock

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$0.968

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388

$0.968

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Parana Technologies

USA . 863 parts In-Stock

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$2.653

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$3.143

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863

$2.653

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$3.143

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DigiPath Technology Company

USA . 1,288 parts In-Stock

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$2.921

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$2.921

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ChromeModa Solutions

Germany . 4,693 parts In-Stock

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$2.981

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$2.444

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$2.981

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IDEA Electronic Components Group

UK . 1,266 parts In-Stock

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$2.981

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$2.683

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$2.981

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AZTECH Wire

Italy . 751 parts In-Stock

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$7.850

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$7.850

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One Stop Electronics

USA . 386 parts In-Stock

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$9.750

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$9.750

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Semicontronic

India . 1,245 parts In-Stock

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$18.750

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$18.281

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$18.188

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$18.750

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$18.188

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Ampacity Inc.

Singapore . 1,647 parts In-Stock

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$43.750

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Component Stockers USA

USA . 622 parts In-Stock

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$99.990

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Corphita

USA . 2,062 parts In-Stock

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Corohmni

South Africa . 262 parts In-Stock

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Overview

Experience cutting-edge technology with the AWR6843ABSABLRQ1 MMWAVE RADAR SENSOR MODULE by Texas Instruments. Designed for precision and reliability, this sensor module offers unmatched performance in a compact package. Whether it's automotive radar systems, industrial automation, or smart home applications, this sensor module provides accurate and real-time data to enhance your products. Trust Texas Instruments to deliver quality and innovation with every product, ensuring that you stay ahead of the curve in today's fast-paced market. Choose the AWR6843ABSABLRQ1 for superior value, benefits, and advantages that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the sensor, ensuring long-lasting performance.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage allows for efficient power usage, preventing damage to the sensor under high voltage conditions.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the sensor module meets automotive industry standards for reliability and quality, making it a suitable choice for automotive applications.

Sensors or Transducers Type: MMWAVE RADAR SENSOR MODULE

MMWAVE radar technology offers high accuracy in detecting objects and measuring distances, making it ideal for applications where precision is essential.

No. of Terminals: 161

With a large number of terminals, the sensor module can interface with multiple components, increasing its versatility and functionality.

Body Height: 0.8 mm

The low body height of 0.8 mm allows for a compact design, making the sensor module suitable for space-constrained applications.

Package Shape or Style: SQUARE

The square package shape makes it easy to mount the sensor module securely, ensuring stability and reliability in operation.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage requirement ensures the sensor module can operate efficiently even under low power conditions, extending its usability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the sensor module to withstand extreme temperature conditions without compromising performance.

Output Range: 0.45-2.85V

The wide output range of 0.45-2.85V provides flexibility in signal output, allowing for customization and adaptability to different applications.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and interpretation, making it easier to integrate the sensor module into digital systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the sensor module can function reliably in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and corrosion resistance, ensuring stable electrical connections for accurate signal transmission.

Output (V): OPEN-DRAIN

The open-drain output configuration allows for easy interfacing with other components, simplifying circuit design and integration.

Technology: RFCMOS

RFCMOS technology offers high-frequency performance and low power consumption, making the sensor module efficient and reliable for demanding applications.

Body Length/Diameter: 10.4 mm

The body length/diameter of 10.4 mm provides a compact form factor, making the sensor module easy to integrate into various devices and systems.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process, allowing for quick and secure attachment to PCBs or other surfaces.

Technical Specifications

Other Function Sensors & Transducers AWR6843ABSABLRQ1 attributes and parameters. Explore more Other Function Sensors & Transducers devices from Texas Instruments

Specs

Body Width:

10.4 inch

Body Height:

.8 mm

Body Length/Diameter:

10.4 mm

Mounting Feature:

No. of Terminals:

161

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

OPEN-DRAIN

Output Range:

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA161,15X15,26

Package Shape or Style:

Screening Level:

AEC-Q100

Sensors or Transducers Type:

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Technology:

RFCMOS

Terminal Finish:

TIN SILVER COPPER

Trade Compliance

AWR6843ABSABLRQ1 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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