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AM26LV32CNSRG4

Texas Instruments

AM26LV32CNSRG4 by Texas Instruments

AM26LV32CNSRG4 by Texas Instruments is a 16-terminal line driver/receiver with 4 functions, operating at 3.3V power supply. It features differential output polarity and Schmitt trigger input characteristics, suitable for EIA-422-B, TIA-422-B, V.11 interfaces in commercial-grade applications requiring fast response times up to 20ns.

Median Price

$0.956

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 995 parts In-Stock

1+ parts

-

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$0.956

995

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$0.956

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.884

100+ parts

-

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300

$0.884

-

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Vyrian

USA . 3,634 parts In-Stock

1+ parts

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3,634

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Digiode

USA . 1,113 parts In-Stock

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1,113

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VNN

France . 264 parts In-Stock

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264

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Distributors (Availability)

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Ampacity Inc.

Singapore . 936 parts In-Stock

1+ parts

$0.810

100+ parts

-

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936

$0.810

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Netroflash

USA . 500 parts In-Stock

1+ parts

$0.884

100+ parts

-

1k+ parts

$0.840

10k+ parts

$0.822

500

$0.884

-

$0.840

$0.822

Parana Technologies

USA . 1,583 parts In-Stock

1+ parts

$2.886

100+ parts

-

1k+ parts

$3.379

10k+ parts

-

1,583

$2.886

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$3.379

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DigiPath Technology Company

USA . 1,725 parts In-Stock

1+ parts

$3.178

100+ parts

$2.924

1k+ parts

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1,725

$3.178

$2.924

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ChromeModa Solutions

Germany . 6,137 parts In-Stock

1+ parts

$3.243

100+ parts

$2.659

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6,137

$3.243

$2.659

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IDEA Electronic Components Group

UK . 894 parts In-Stock

1+ parts

$3.243

100+ parts

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$2.919

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894

$3.243

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$2.919

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AZTECH Wire

Italy . 657 parts In-Stock

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$5.219

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657

$5.219

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iodParts Technologies Inc.

India . 9,660 parts In-Stock

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Microchip USA

USA . 2,534 parts In-Stock

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2,534

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Corphita

USA . 94 parts In-Stock

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94

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Overview

Enhance your electronic designs with the AM26LV32CNSRG4 by Texas Instruments, a top-quality line driver & receiver that promises reliable performance and seamless integration. Manufactured by industry leader Texas Instruments, this product offers unparalleled value with its versatile applications in various industries. With its compact package style and advanced technology, the AM26LV32CNSRG4 ensures efficient signal transmission and optimal output characteristics. Elevate your projects with this innovative solution that guarantees exceptional quality and superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside the package, ensuring reliable performance.

Surface Mount: YES

This allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can accommodate various power requirements, making it versatile in different applications.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional devices, saving cost and board space.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the circuit board and easy integration into the overall system design.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with standard power supply voltages, ensuring easy integration into existing systems.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for interfacing with other components, enhancing functionality.

Maximum High Level Input Current: 0.00001 Amp

The low input current allows for efficient power consumption and minimizes heat generation, improving overall energy efficiency.

Output Characteristics: DIFFERENTIAL

Differential outputs help to reduce noise and interference, ensuring reliable signal transmission over long distances.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Line Drivers & Receivers AM26LV32CNSRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

5 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

4

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

17 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

AM26LV32CNSRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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