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AM26LS33AMFKB

Texas Instruments

AM26LS33AMFKB by Texas Instruments

AM26LS33AMFKB by Texas Instruments is a 20-terminal chip carrier with 4 functions, operating at -55 to 125 °C. It features EIA-422-B interface standard, MIL-STD-883 Class B screening level, and 5V power supplies. Ideal for military-grade applications requiring true output polarity and differential Schmitt trigger input characteristics.

Median Price

$26.580

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$26.580

100+ parts

$26.050

1k+ parts

$25.520

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2

$26.580

$26.050

$25.520

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Distributors (In-Stock)

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Digiode

USA . 4,937 parts In-Stock

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$25.251

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$25.251

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Vyrian

USA . 7,723 parts In-Stock

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Chip Stock

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Resion

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Odi Ramu Company

Canada . 9 parts In-Stock

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North Shore Components

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Electronics Depot

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NAC Semi

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Distributors (Availability)

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Parana Technologies

USA . 1,926 parts In-Stock

1+ parts

$10.122

100+ parts

-

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$10.668

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1,926

$10.122

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$10.668

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DigiPath Technology Company

USA . 1,945 parts In-Stock

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$11.146

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$10.254

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ChromeModa Solutions

Germany . 3,914 parts In-Stock

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$11.373

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$9.326

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$11.373

$9.326

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IDEA Electronic Components Group

UK . 1,456 parts In-Stock

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$11.373

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$10.804

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$10.236

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AZTECH Wire

Italy . 750 parts In-Stock

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$12.630

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$12.630

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$22.590

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Corphita

USA . 1,812 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,340 parts In-Stock

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Microchip USA

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Component Stockers USA

USA . 1,727 parts In-Stock

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Native Components

USA . 827 parts In-Stock

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Northwest PG Solutions

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ChipstoGo Electronic ltd

UK . 16 parts In-Stock

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Perfect Parts

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Overview

Elevate your electronic designs with the AM26LS33AMFKB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers like this one that offer unparalleled reliability and performance. Ideal for military-grade applications, this versatile chip carrier provides true output polarity and differential Schmitt trigger input characteristics. With a maximum operating temperature of 125°C and a screening level of MIL-STD-883 Class B, the AM26LS33AMFKB ensures optimal functionality under demanding conditions. Upgrade your projects today with this high-value, high-performance solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides robust protection for the line driver & receiver, making it suitable for harsh environments.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.5 V

Can handle relatively high supply voltages, ensuring stable operation and preventing damage from over-voltage situations.

No. of Functions: 4

Offers multiple functions in a single component, reducing the need for additional components and simplifying circuit design.

Interface Standard: EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

Meets industry standards for communication interfaces, ensuring compatibility with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers AM26LS33AMFKB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

.02 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

2.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

AM26LS33AMFKB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-392-8197, 5962013928197

NIIN

013928197

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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