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AM26LS32AMJB

Texas Instruments

AM26LS32AMJB by Texas Instruments

LINE RECEIVER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$56.065

Lifecycle Status

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27

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1k+

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Chip1Stop

Japan . 2 parts In-Stock

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Arrow

USA . 5 parts In-Stock

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$67.330

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$61.310

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$60.100

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Freelance Electronics

USA . 11 parts In-Stock

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$15.721

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$16.507

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$15.721

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Nova Conductors

Japan . 600 parts In-Stock

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NAC Semi

USA . 6 parts In-Stock

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Digiode

USA . 4,820 parts In-Stock

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Bristol Electronics

USA . 12 parts In-Stock

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Vyrian

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VNN

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Chip Stock

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Beltway Electronics Company

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Inland Empire Components Inc.

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Mil-Aero Solutions, Inc.

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Microfarads

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LWI Electronics Inc

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Speed Components Ltd

Israel . 7 parts In-Stock

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PC Components Company LLC

USA . 5 parts In-Stock

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Holdelec - ElecDif-Pro

France . 4 parts In-Stock

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North Shore Components

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Manoshevitz Elec. Sales

Israel . 4 parts In-Stock

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Electronics Depot

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Electronic Expediters

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Resion

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Quantum Digital Technology

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AZTECH Wire

Italy . 700 parts In-Stock

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Parana Technologies

USA . 155 parts In-Stock

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$13.065

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DigiPath Technology Company

USA . 2,111 parts In-Stock

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ChromeModa Solutions

Germany . 6,950 parts In-Stock

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$12.038

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IDEA Electronic Components Group

UK . 1,090 parts In-Stock

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$13.946

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Continental Prestige Electronics

USA . 1,449 parts In-Stock

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$28.110

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$27.548

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Corphita

USA . 3,036 parts In-Stock

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Ampacity Inc.

Singapore . 2 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Microchip USA

USA . 2,586 parts In-Stock

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Perfect Parts

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Netroflash

USA . 1,000 parts In-Stock

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$26.705

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$26.142

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Kepictronics

USA . 550 parts In-Stock

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Assy Fe

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Technical Specifications

Line Drivers & Receivers AM26LS32AMJB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

AM26LS32AMJB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-107-5395, 5962011075395, 5962-01-394-8421, 5962013948421, 5962-01-361-5421, 5962013615421

NIIN

011075395, 013948421, 013615421

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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