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AM26C32IPWRG4

Texas Instruments

AM26C32IPWRG4 by Texas Instruments

AM26C32IPWRG4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at -40 to 85 °C. It has a max supply voltage of 5.5 V and uses BICMOS technology. Ideal for industrial applications requiring EIA-422-B, TIA-422-B, EIA-423-B, TIA-423-B, V.10, or V.11 interface standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 37,290 parts In-Stock

1+ parts

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37,290

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Digiode

USA . 4,868 parts In-Stock

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4,868

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Vyrian

USA . 2,617 parts In-Stock

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2,617

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VNN

France . 30 parts In-Stock

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30

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Nova Conductors

Japan . 16 parts In-Stock

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 87 parts In-Stock

1+ parts

$4.600

100+ parts

-

1k+ parts

$5.065

10k+ parts

-

87

$4.600

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$5.065

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DigiPath Technology Company

USA . 33 parts In-Stock

1+ parts

$5.066

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-

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33

$5.066

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ChromeModa Solutions

Germany . 4,998 parts In-Stock

1+ parts

$5.169

100+ parts

$4.239

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-

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4,998

$5.169

$4.239

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IDEA Electronic Components Group

UK . 2,293 parts In-Stock

1+ parts

$5.169

100+ parts

-

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$4.652

10k+ parts

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2,293

$5.169

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$4.652

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AZTECH Wire

Italy . 684 parts In-Stock

1+ parts

$11.379

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684

$11.379

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Corohmni

South Africa . 224 parts In-Stock

1+ parts

$12.935

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224

$12.935

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Semicontronic

India . 486 parts In-Stock

1+ parts

$36.500

100+ parts

$35.588

1k+ parts

$35.405

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486

$36.500

$35.588

$35.405

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Ampacity Inc.

Singapore . 445 parts In-Stock

1+ parts

$43.500

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445

$43.500

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One Stop Electronics

USA . 588 parts In-Stock

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$49.500

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588

$49.500

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QUARKTWIN TECHNOLOGY LTD

USA . 20,151 parts In-Stock

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Microchip USA

USA . 10,493 parts In-Stock

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Corphita

USA . 3,260 parts In-Stock

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3,260

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Continental Prestige Electronics

USA . 2,416 parts In-Stock

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2,416

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Argo Parts USA

USA . 749 parts In-Stock

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749

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Advanced Electronics

New Zealand . 96 parts In-Stock

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96

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Experience superior performance and reliability with the AM26C32IPWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Line Drivers & Receivers that are perfect for a wide range of applications. From industrial automation to telecommunications, this product offers unmatched value with its advanced technology and precision engineering. Trust Texas Instruments to provide you with the cutting-edge solutions you need to take your projects to the next level. Elevate your performance with the AM26C32IPWRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product can withstand rough handling and environmental conditions.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Can handle a high supply voltage, making it versatile and compatible with a wide range of systems.

No. of Functions: 4

Multi-functional design provides flexibility and efficiency in operation.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy to integrate into various system designs.

Power Supplies (V): 5

Operates at a common voltage level, ensuring compatibility with many power sources.

No. of Terminals: 16

Sufficient terminals for connections, enabling various input and output options.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, suitable for a wide range of environments.

Maximum Seated Height: 1.2 mm

Low profile design saves space and allows for compact device construction.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during assembly, ensuring proper soldering and reliability.

Technical Specifications

Line Drivers & Receivers AM26C32IPWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

6 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

27 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

AM26C32IPWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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