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AM26C31IDBRG4

Texas Instruments

AM26C31IDBRG4 by Texas Instruments

AM26C31IDBRG4 by Texas Instruments is a 4-bit line driver with 3-STATE output, operating at -40 to 85 °C. It has a max supply voltage of 5.5 V and differential output for EIA-422-B, TIA-422-B, V.11 interfaces. Ideal for industrial applications requiring high-speed data transmission within tight space constraints.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 2,717 parts In-Stock

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Vyrian

USA . 1,973 parts In-Stock

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1,973

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Digiode

USA . 983 parts In-Stock

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983

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Nova Conductors

Japan . 70 parts In-Stock

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70

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Distributors (Availability)

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Corohmni

South Africa . 350 parts In-Stock

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$2.310

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350

$2.310

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Parana Technologies

USA . 1,629 parts In-Stock

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$6.645

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$7.360

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$6.645

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$7.360

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DigiPath Technology Company

USA . 263 parts In-Stock

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$7.317

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$6.731

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263

$7.317

$6.731

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ChromeModa Solutions

Germany . 4,400 parts In-Stock

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$7.466

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$6.122

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$7.466

$6.122

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IDEA Electronic Components Group

UK . 1,897 parts In-Stock

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$7.466

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$6.719

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AZTECH Wire

Italy . 812 parts In-Stock

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$13.111

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Semicontronic

India . 1,555 parts In-Stock

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$19.500

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$19.012

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$18.915

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Ampacity Inc.

Singapore . 479 parts In-Stock

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$39.500

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One Stop Electronics

USA . 1,247 parts In-Stock

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$43.500

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Component Stockers USA

USA . 250 parts In-Stock

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$99.990

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iodParts Technologies Inc.

India . 7,899 parts In-Stock

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Microchip USA

USA . 4,022 parts In-Stock

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Corphita

USA . 3,541 parts In-Stock

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Continental Prestige Electronics

USA . 1,763 parts In-Stock

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Argo Parts USA

USA . 1,510 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the AM26C31IDBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional line drivers & receivers like this one that are perfect for a wide range of applications. From industrial to commercial uses, this product offers unmatched value, benefits, and advantages to customers. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and brings your projects to the next level. Choose the AM26C31IDBRG4 for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving, making this product suitable for compact electronic designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle a wide range of input voltages, providing flexibility in different operating conditions.

No. of Functions: 4

Having multiple functions in a single package simplifies the design and integration process, making it a cost-effective solution for applications requiring multiple functions.

Maximum Transmit Delay: 12 ns

The low transmit delay ensures fast data transmission, making the product suitable for high-speed communication applications.

Power Supplies (V): 5

The product operates on a standard 5V power supply, making it compatible with common power sources and easy to integrate into existing systems.

No. of Terminals: 16

Having a higher number of terminals allows for more connectivity options, enabling the product to interface with a variety of devices and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, making the product suitable for industrial applications.

Width: 5.3 mm

The compact width of the product saves space in electronic designs, making it ideal for applications where size constraints are a concern.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliance with industry-standard interface protocols ensures compatibility with a wide range of devices, making it a versatile choice for various applications.

Technical Specifications

Line Drivers & Receivers AM26C31IDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

AM26C31IDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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