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AM26C31IDBRE4

Texas Instruments

AM26C31IDBRE4 by Texas Instruments

AM26C31IDBRE4 by Texas Instruments is a 16-terminal line driver with 4 functions, operating at temperatures from -40 to 85°C. It features a max supply voltage of 5.5V, differential output, and interface standards EIA-422-B, TIA-422-B, V.11. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$0.662

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$0.662

100+ parts

-

1k+ parts

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25

$0.662

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Vyrian

USA . 6,219 parts In-Stock

1+ parts

-

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6,219

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VNN

France . 1,843 parts In-Stock

1+ parts

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1,843

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-

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Digiode

USA . 391 parts In-Stock

1+ parts

-

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1k+ parts

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391

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,512 parts In-Stock

1+ parts

$0.662

100+ parts

-

1k+ parts

-

10k+ parts

$0.642

4,512

$0.662

-

-

$0.642

Continental Prestige Electronics

USA . 1,945 parts In-Stock

1+ parts

$0.662

100+ parts

-

1k+ parts

-

10k+ parts

$0.649

1,945

$0.662

-

-

$0.649

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.662

100+ parts

$0.649

1k+ parts

-

10k+ parts

-

50

$0.662

$0.649

-

-

One Stop Electronics

USA . 199 parts In-Stock

1+ parts

$3.500

100+ parts

-

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10k+ parts

-

199

$3.500

-

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Parana Technologies

USA . 1,944 parts In-Stock

1+ parts

$9.628

100+ parts

$894.108

1k+ parts

$8.665

10k+ parts

-

1,944

$9.628

$894.108

$8.665

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DigiPath Technology Company

USA . 1,422 parts In-Stock

1+ parts

$10.602

100+ parts

-

1k+ parts

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10k+ parts

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1,422

$10.602

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ChromeModa Solutions

Germany . 2,216 parts In-Stock

1+ parts

$10.818

100+ parts

$8.871

1k+ parts

-

10k+ parts

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2,216

$10.818

$8.871

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IDEA Electronic Components Group

UK . 933 parts In-Stock

1+ parts

$10.818

100+ parts

$10.277

1k+ parts

$9.736

10k+ parts

-

933

$10.818

$10.277

$9.736

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Corohmni

South Africa . 200 parts In-Stock

1+ parts

$11.921

100+ parts

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200

$11.921

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AZTECH Wire

Italy . 536 parts In-Stock

1+ parts

$14.337

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536

$14.337

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Semicontronic

India . 819 parts In-Stock

1+ parts

$40.500

100+ parts

$39.488

1k+ parts

$39.285

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819

$40.500

$39.488

$39.285

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Ampacity Inc.

Singapore . 1,025 parts In-Stock

1+ parts

$43.500

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1,025

$43.500

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Microchip USA

USA . 12,140 parts In-Stock

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12,140

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iodParts Technologies Inc.

India . 7,899 parts In-Stock

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7,899

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Corphita

USA . 2,949 parts In-Stock

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2,949

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Perfect Parts

USA . 2,191 parts In-Stock

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2,191

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Overview

Enhance your electronic designs with the AM26C31IDBRE4 by Texas Instruments, a high-quality line driver & receiver offering superior performance and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for industrial applications requiring precise signal transmission. With its compact design and advanced technology, this line driver ensures efficient communication while maintaining low power consumption. Trust Texas Instruments for cutting-edge solutions that deliver unmatched value and performance. Upgrade your projects today with the AM26C31IDBRE4 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and can withstand various environmental conditions, making the product long-lasting.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for better compatibility with various systems and power sources.

Maximum Transmit Delay: 12 ns

Low transmit delay ensures fast data transmission, making the product suitable for real-time applications.

Output Characteristics: 3-STATE

3-state output allows the driver to be in high impedance mode when not driving the bus, reducing power consumption and enabling multi-drop configurations.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures that the product can operate efficiently even in harsh industrial environments.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS technologies, providing high-speed operation with low power consumption, making the product energy-efficient.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliance with various interface standards ensures compatibility with different communication protocols and devices.

Technical Specifications

Line Drivers & Receivers AM26C31IDBRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

AM26C31IDBRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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