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AM26C31CDG4

Texas Instruments

AM26C31CDG4 by Texas Instruments

AM26C31CDG4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features a max transmit delay of 12ns and output polarity is complementary. Ideal for EIA-422-B, TIA-422-B, V.11 interfaces in commercial-grade applications.

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 663 parts In-Stock

1+ parts

$1.620

100+ parts

-

1k+ parts

$0.736

10k+ parts

$0.628

663

$1.620

-

$0.736

$0.628

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,107 parts In-Stock

1+ parts

$1.539

100+ parts

-

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-

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2,107

$1.539

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Vyrian

USA . 3,134 parts In-Stock

1+ parts

-

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3,134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,191 parts In-Stock

1+ parts

$1.458

100+ parts

-

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-

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3,191

$1.458

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Component Stockers USA

USA . 1,159 parts In-Stock

1+ parts

$1.600

100+ parts

$1.430

1k+ parts

-

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1,159

$1.600

$1.430

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-

Parana Technologies

USA . 71 parts In-Stock

1+ parts

$5.240

100+ parts

$486.643

1k+ parts

$4.716

10k+ parts

-

71

$5.240

$486.643

$4.716

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DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$5.770

100+ parts

$5.309

1k+ parts

-

10k+ parts

-

1,992

$5.770

$5.309

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ChromeModa Solutions

Germany . 2,450 parts In-Stock

1+ parts

$5.888

100+ parts

$4.828

1k+ parts

-

10k+ parts

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2,450

$5.888

$4.828

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IDEA Electronic Components Group

UK . 923 parts In-Stock

1+ parts

$5.888

100+ parts

-

1k+ parts

$5.299

10k+ parts

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923

$5.888

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$5.299

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Northwest PG Solutions

USA . 1,815 parts In-Stock

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1,815

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Native Components

USA . 292 parts In-Stock

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292

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Overview

Discover the unparalleled performance and reliability of the Texas Instruments AM26C31CDG4 Line Driver & Receiver. With a reputation for cutting-edge technology and exceptional quality, Texas Instruments delivers industry-leading solutions for a wide range of applications. Whether you're looking to enhance data transmission or improve signal integrity, this versatile product offers unmatched value and benefits. Trust in Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-lasting applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space in electronic devices.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5V, providing compatibility with a wide range of electronic systems.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, simplifying the overall circuit design.

Maximum Transmit Delay: 12 ns

Low transmit delay ensures fast signal transmission, making it suitable for high-speed communication applications.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it easy to integrate into existing systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for high-density mounting on PCBs.

Maximum Output Low Current: 20 Amp

Capable of handling high output currents, making it suitable for driving loads with higher power requirements.

Technology: BICMOS

Utilizes BICMOS technology, combining the advantages of bipolar and CMOS technologies for improved performance and efficiency.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliant with multiple interface standards for versatile connectivity options in various communication systems.

Technical Specifications

Line Drivers & Receivers AM26C31CDG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

3.9 mm

Trade Compliance

AM26C31CDG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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