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AM26C31CDBRG4

Texas Instruments

AM26C31CDBRG4 by Texas Instruments

AM26C31CDBRG4 by Texas Instruments is a 16-terminal LINE DRIVER with 4 functions. It operates at 5V, has a max transmit delay of 12ns, and supports EIA-422-B interface standard. Ideal for applications requiring differential output and commercial temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 5,280 parts In-Stock

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5,280

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Vyrian

USA . 2,723 parts In-Stock

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2,723

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Digiode

USA . 2,169 parts In-Stock

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2,169

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 31 parts In-Stock

1+ parts

$8.113

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31

$8.113

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$12.339

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$11.722

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$11.722

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50

$12.339

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$11.722

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Parana Technologies

USA . 1,952 parts In-Stock

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$13.313

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$13.820

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$13.313

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$13.820

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DigiPath Technology Company

USA . 2,299 parts In-Stock

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$14.659

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$14.659

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ChromeModa Solutions

Germany . 2,404 parts In-Stock

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$14.958

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$12.266

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$14.958

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IDEA Electronic Components Group

UK . 1,515 parts In-Stock

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$14.958

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$14.210

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$13.462

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AZTECH Wire

Italy . 450 parts In-Stock

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$17.219

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Ampacity Inc.

Singapore . 1,486 parts In-Stock

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$19.500

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One Stop Electronics

USA . 1,283 parts In-Stock

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$19.500

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$19.500

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Semicontronic

India . 318 parts In-Stock

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$36.500

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$35.588

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$35.405

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318

$36.500

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Argo Parts USA

USA . 4,198 parts In-Stock

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Microchip USA

USA . 2,086 parts In-Stock

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Corphita

USA . 1,005 parts In-Stock

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the AM26C31CDBRG4 Line Driver & Receiver. This versatile component offers superior performance in a wide range of applications, from telecommunications to industrial control systems. With its advanced technology and innovative design, this product provides customers with exceptional value, efficiency, and precision. Trust Texas Instruments for all your line driver needs and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the line driver and receiver.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

Handles a maximum supply voltage of 5.5V, ensuring compatibility with a wide range of power sources.

No. of Functions: 4

Having 4 functions in one device helps in reducing component count and simplifies the design of the system.

Maximum Transmit Delay: 12 ns

Low transmit delay of 12ns ensures fast signal transmission, making it suitable for high-speed data communication applications.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it easy to integrate into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, it can operate reliably in a variety of environments.

Output Characteristics: 3-STATE

3-state output allows the line driver to assume a high impedance state, which can be useful for sharing a common bus among multiple devices.

Technology: BICMOS

BiCMOS technology combines the advantages of both bipolar and CMOS technologies, providing high speed and low power consumption.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliant with industry standards EIA-422-B, TIA-422-B, and V.11, ensuring interoperability with other devices following the same standards.

Technical Specifications

Line Drivers & Receivers AM26C31CDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

AM26C31CDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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