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AFE7906IALK

Texas Instruments

AFE7906IALK by Texas Instruments

AFE7906IALK by Texas Instruments is a 14-bit ADC with 6 analog in channels, operating from -40 to 85°C. It features a sample rate of 3000 MHz and output format in serial, suitable for high-speed data acquisition applications. The package style is grid array with fine pitch, making it ideal for compact designs requiring precise analog-to-digital conversion.

Median Price

$1,782.110

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,955 parts In-Stock

1+ parts

$1,414.800

100+ parts

$1,296.900

1k+ parts

$1,179.000

10k+ parts

-

1,955

$1,414.800

$1,296.900

$1,179.000

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$2,149.420

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$2,149.420

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 566 parts In-Stock

1+ parts

$1,344.060

100+ parts

-

1k+ parts

-

10k+ parts

-

566

$1,344.060

-

-

-

Vyrian

USA . 5,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,529

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,756 parts In-Stock

1+ parts

$13.565

100+ parts

-

1k+ parts

$14.069

10k+ parts

-

1,756

$13.565

-

$14.069

-

DigiPath Technology Company

USA . 509 parts In-Stock

1+ parts

$14.937

100+ parts

$13.742

1k+ parts

-

10k+ parts

-

509

$14.937

$13.742

-

-

ChromeModa Solutions

Germany . 3,475 parts In-Stock

1+ parts

$15.242

100+ parts

$12.498

1k+ parts

-

10k+ parts

-

3,475

$15.242

$12.498

-

-

IDEA Electronic Components Group

UK . 1,366 parts In-Stock

1+ parts

$15.242

100+ parts

$14.480

1k+ parts

$13.718

10k+ parts

-

1,366

$15.242

$14.480

$13.718

-

Ampacity Inc.

Singapore . 818 parts In-Stock

1+ parts

$1,202.580

100+ parts

-

1k+ parts

-

10k+ parts

-

818

$1,202.580

-

-

-

Semicontronic

India . 653 parts In-Stock

1+ parts

$1,202.580

100+ parts

$1,172.516

1k+ parts

$1,166.503

10k+ parts

-

653

$1,202.580

$1,172.516

$1,166.503

-

Corphita

USA . 2,010 parts In-Stock

1+ parts

$1,273.320

100+ parts

-

1k+ parts

-

10k+ parts

-

2,010

$1,273.320

-

-

-

Corohmni

South Africa . 406 parts In-Stock

1+ parts

$1,414.800

100+ parts

-

1k+ parts

-

10k+ parts

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406

$1,414.800

-

-

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Northwest PG Solutions

USA . 966 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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966

-

-

-

-

Native Components

USA . 379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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379

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-

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Overview

Experience unparalleled precision and reliability with the AFE7906IALK by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers cutting-edge technology that ensures optimal performance in various applications. With 6 analog input channels and 14 bits of resolution, this converter offers unmatched accuracy and speed. Whether you're working on industrial automation, medical devices, or automotive systems, this product provides the ultimate value, efficiency, and flexibility for your projects. Trust Texas Instruments to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the ADC, ensuring reliable performance over time.

No. of Analog In Channels: 6

Having 6 analog input channels allows for versatility in connecting multiple input signals to the ADC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easy to fit into tight spaces within electronic devices.

No. of Bits: 14

With 14 bits of resolution, this ADC can provide accurate and detailed conversion of analog signals into digital data, suitable for high-precision applications.

No. of Terminals: 400

Having 400 terminals allows for efficient connectivity and communication with other components in the system, enabling seamless operation.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style offers high reliability and optimal signal routing, ensuring consistent performance in demanding environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable operation in a wide range of temperature conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the ADC can function effectively even in extreme cold environments, enhancing its versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability, facilitating easy installation and assembly of the ADC onto circuit boards.

Terminal Position: BOTTOM

Having terminals positioned at the bottom of the package enables easy and secure connection to the circuit board, ensuring stable operation.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm allows for a compact and space-saving design, making it ideal for applications with size constraints.

Width: 17 mm

The 17 mm width provides a balance between compactness and ease of integration, making the ADC suitable for various electronic devices.

Peak Reflow Temperature °C: 220

The high peak reflow temperature of 220°C ensures reliable soldering during manufacturing processes, leading to a robust and durable product.

Length: 17 mm

With a length of 17 mm, the ADC can easily fit into standard PCB layouts, simplifying the design and integration process.

Sample Rate: 3000 MHz

A high sample rate of 3000 MHz enables quick and accurate conversion of analog signals, making this ADC suitable for high-speed applications.

Terminal Form: BALL

Having terminals in the form of balls allows for reliable and secure connections, ensuring stable operation of the ADC in dynamic environments.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary method used in this ADC ensures unique and optimized conversion algorithms, resulting in high performance and accuracy.

Nominal Supply Voltage: 1.2 V

With a low nominal supply voltage of 1.2 V, this ADC offers energy-efficient operation, making it suitable for battery-powered devices.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interpretation, making it easy to interface with digital systems and microcontrollers.

Terminal Pitch: 0.8 mm

Having a terminal pitch of 0.8 mm allows for precise and compact placement on the PCB, enhancing signal integrity and reliability.

Output Format: SERIAL

Serial output format enables easy data transmission and integration with serial interfaces, making it compatible with a wide range of systems.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the ADC is moderately sensitive to moisture, requiring standard handling procedures during manufacturing and storage.

Technical Specifications

Analog-to-Digital Converters AFE7906IALK attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

6

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

3000 MHz

Electrical Specifications

Nominal Supply Voltage:

1.2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

220 °C (428 °F)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

400

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.669 in (17 mm)

Length:

0.669 in (17 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA400,20X20,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e0

Trade Compliance

AFE7906IALK Converters trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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