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AF100-2CG

Texas Instruments

AF100-2CG by Texas Instruments

AF100-2CG by Texas Instruments is a bipolar active filter with 12 wire terminals in a cylindrical metal package. It operates b/w -25°C to 85°C and offers universal response types like Butterworth, Bessel, Elliptic, and Chebyshev. Ideal for applications requiring precise filtering in various temperature conditions.

Median Price

$15.000

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 332 parts In-Stock

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$15.000

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$8.625

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Digiode

USA . 3,693 parts In-Stock

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Vyrian

USA . 3,113 parts In-Stock

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Anansix

USA . 1,322 parts In-Stock

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Electronic Expediters

USA . 1,089 parts In-Stock

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Microfarads

USA . 309 parts In-Stock

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ECAB

Sweden . 20 parts In-Stock

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Resion

USA . 4 parts In-Stock

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Electronics Depot

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 621 parts In-Stock

1+ parts

$4.860

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$5.385

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621

$4.860

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Native Components

USA . 318 parts In-Stock

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$5.140

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AZTECH Wire

Italy . 238 parts In-Stock

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$5.169

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DigiPath Technology Company

USA . 1,212 parts In-Stock

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$5.352

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IDEA Electronic Components Group

UK . 950 parts In-Stock

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$5.461

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$4.915

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950

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ChromeModa Solutions

Germany . 141 parts In-Stock

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$5.461

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$4.478

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141

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One Stop Electronics

USA . 326 parts In-Stock

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$5.690

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Northwest PG Solutions

USA . 782 parts In-Stock

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$5.037

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Corphita

USA . 344 parts In-Stock

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Overview

Elevate your electronic designs with the AF100-2CG by Texas Instruments. This high-quality active filter offers unmatched precision and reliability, thanks to the renowned manufacturer's commitment to excellence. Ideal for a wide range of applications, from audio systems to telecommunications equipment, this product stands out for its superior performance and durability. Experience the value and benefits of choosing Texas Instruments for your filtering needs, and take your projects to the next level with the AF100-2CG.

Feature Benefit Bullets

Package Body Material: METAL

The metal body material provides durability and protection, making the filter suitable for rugged environments.

Technology: BIPOLAR

The bipolar technology ensures high performance and accurate filtering capabilities.

Package Shape: ROUND

The round shape allows for efficient space utilization and easy installation in various applications.

Terminal Form: WIRE

The wire terminal form provides a secure connection and easy integration into different circuit setups.

No. of Terminals: 12

The 12 terminals offer flexibility in connecting the filter to multiple components or circuits.

Package Style: CYLINDRICAL

The cylindrical package style ensures efficient heat dissipation and overall stability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the filter to perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature enables the filter to function effectively even in cold climates or low temperature settings.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections in circuit layouts.

Response Type: UNIVERSAL

The universal response type allows the filter to adapt to different filtering requirements and signal characteristics.

Transfer Characteristics: BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV

The multiple transfer characteristics options offer versatility in filtering applications, catering to various design needs.

Technical Specifications

Active Filters AF100-2CG attributes and parameters. Explore more Active Filters devices from Texas Instruments

Performance Parameters

Semiconductor Technology:

Bipolar

Response Type:

Transfer Characteristics:

Butterworth/Bessel/Elliptical/Chebyshev

Environmental Characteristics

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-25 °C (-13 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

12

Terminal Finish:

Tin/Lead

Terminal Form:

Terminal Position:

Bottom

Physical Characteristics

Package Style:

Cylindrical

Form Factor:

Round

Package Equivalence Code:

CAN12,.23

Package Body Material:

Metal

JESD-30 Code:

O-MBCY-W12

JESD-609 Code:

e0

Additional Features

Qualified:

No

Trade Compliance

AF100-2CG Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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