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ADS901EG4

Texas Instruments

ADS901EG4 by Texas Instruments

The Texas Instruments ADS901EG4 is a 10-bit ADC with 20 MHz sample rate, ideal for industrial applications. It operates at temperatures from -40 to 85°C and has a small outline package with 28 terminals. With a CMOS technology and offset binary output, it offers precise analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,622 parts In-Stock

1+ parts

-

100+ parts

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2,622

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Vyrian

USA . 2,400 parts In-Stock

1+ parts

-

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2,400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 467 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

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10k+ parts

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467

$0.940

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Northwest PG Solutions

USA . 264 parts In-Stock

1+ parts

$1.034

100+ parts

-

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264

$1.034

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Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

$12.762

100+ parts

$1,185.118

1k+ parts

$11.486

10k+ parts

-

1,412

$12.762

$1,185.118

$11.486

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DigiPath Technology Company

USA . 208 parts In-Stock

1+ parts

$14.052

100+ parts

-

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208

$14.052

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ChromeModa Solutions

Germany . 3,531 parts In-Stock

1+ parts

$14.339

100+ parts

$11.758

1k+ parts

-

10k+ parts

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3,531

$14.339

$11.758

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IDEA Electronic Components Group

UK . 1,564 parts In-Stock

1+ parts

$14.339

100+ parts

$13.622

1k+ parts

$12.905

10k+ parts

-

1,564

$14.339

$13.622

$12.905

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AZTECH Wire

Italy . 592 parts In-Stock

1+ parts

$15.775

100+ parts

-

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592

$15.775

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One Stop Electronics

USA . 741 parts In-Stock

1+ parts

$33.000

100+ parts

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741

$33.000

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Corphita

USA . 4,579 parts In-Stock

1+ parts

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4,579

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Overview

Unlock a world of precision and reliability with the Texas Instruments ADS901EG4 Analog-to-Digital Converter. Crafted by industry-leading experts, this high-quality component offers unparalleled performance for a wide range of applications. With a compact package design and versatile features, this converter ensures seamless integration and optimal functionality. Experience the value of superior technology and unleash the potential of your projects with the ADS901EG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for internal components, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and facilitating automated assembly processes.

No. of Bits: 10

Offers high resolution for accurate conversion of analog signals to digital data.

Power Supplies (V): 3

Operates efficiently within standard voltage ranges, making it compatible with common power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a concern.

Sample Rate: 20 MHz

Provides fast sampling rate, ensuring real-time conversion of analog signals for high-speed applications.

Technical Specifications

Analog-to-Digital Converters ADS901EG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Sample Rate:

20 MHz

Hold Mode:

Track

Maximum Conversion Time:

100 µs

Electrical Specifications

Power Supplies:

3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

1 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS901EG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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