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ADS8556EVM

Texas Instruments

ADS8556EVM by Texas Instruments

The Texas Instruments ADS8556EVM is a Development Board for 6 16-bit ADCs with sampling rates of 450k and 630k SPS. It features serial and parallel data interfaces, ±4 x VREF input range, and utilizes the ADS8556 IC. Ideal for evaluating Analog to Digital Converters in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,379 parts In-Stock

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Digiode

USA . 2,436 parts In-Stock

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AZTECH Wire

Italy . 469 parts In-Stock

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$9.129

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469

$9.129

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Semicontronic

India . 426 parts In-Stock

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$16.100

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$15.698

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$15.617

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Ampacity Inc.

Singapore . 466 parts In-Stock

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$42.100

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One Stop Electronics

USA . 1,043 parts In-Stock

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$115.100

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Native Components

USA . 501 parts In-Stock

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$197.310

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$189.418

501

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$189.418

Northwest PG Solutions

USA . 300 parts In-Stock

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$217.041

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DigiPath Technology Company

USA . 1,624 parts In-Stock

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Corphita

USA . 816 parts In-Stock

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ChromeModa Solutions

Germany . 601 parts In-Stock

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Parana Technologies

USA . 505 parts In-Stock

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$1.132

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Corohmni

South Africa . 408 parts In-Stock

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IDEA Electronic Components Group

UK . 86 parts In-Stock

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Overview

Discover the cutting-edge technology of the ADS8556EVM by Texas Instruments, a high-quality evaluation board that offers unparalleled performance and precision in analog to digital conversion. Designed by a trusted manufacturer, this versatile board is perfect for applications in development, testing, and prototyping. With its multiple A/D converters, high sampling rates, and flexible data interface options, the ADS8556EVM provides customers with unmatched value and ease of use. Experience the benefits of this innovative product and unlock a world of possibilities in your projects today.

Feature Benefit Bullets

Number of A/D Converters: 6

Having 6 A/D converters allows for multiple channels to be sampled simultaneously, improving efficiency and accuracy in data acquisition.

Number of Bits: 16

With a high resolution of 16 bits, this product can provide precise and detailed digital conversion of analog signals.

Sampling Rate (Per Second): 450k, 630k

The high sampling rates of 450k and 630k samples per second ensure fast and real-time data acquisition, suitable for applications requiring quick response times.

Data Interface: Serial, Parallel

Support for both serial and parallel data interfaces provides flexibility in connecting to different systems or devices, making it versatile and easy to integrate.

Input Range: ±4 x VREF

The wide input range of ±4 x VREF allows for accommodating various analog signal levels without the need for additional external conditioning circuitry, simplifying the design and reducing costs.

Supplied Contents: Board(s)

The inclusion of the necessary board(s) in the package provides users with a complete evaluation platform, ready for testing and development without the need to purchase additional components.

Technical Specifications

Additional Parts ADS8556EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

ADS8556EVM-ND
296-30713-ND
296-ADS8556EVM
296-30713

Category:

Development Boards, Kits, Programmers
Evaluation Boards Analog to Digital Converters (ADCs) Evaluation Boards

Number of A/D Converters:

6

Data Interface:

Serial, Parallel

Standard Package:

1

Supplied Contents:

Board(s)

Input Range:

±4 x VREF

Number of Bits:

16

Utilized IC / Part:

ADS8556

Package:

Box

Sampling Rate (Per Second):

450k, 630k

Base Product Number:

ADS8556

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

ADS8556EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8543.70.9860

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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