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ADS58C28IRGC25

Texas Instruments

ADS58C28IRGC25 by Texas Instruments

Texas Instruments ADS58C28IRGC25 is a CMOS line receiver with 2 functions, operating at -40 to 85°C. It has a supply voltage range of 1.7-1.9V and comes in a 64-terminal chip carrier package. Ideal for industrial applications requiring differential input characteristics and high-speed data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,005 parts In-Stock

1+ parts

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4,005

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Digiode

USA . 1,273 parts In-Stock

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1,273

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 16 parts In-Stock

1+ parts

$0.471

100+ parts

-

1k+ parts

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10k+ parts

$0.452

16

$0.471

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-

$0.452

Northwest PG Solutions

USA . 429 parts In-Stock

1+ parts

$0.518

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-

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$0.457

429

$0.518

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-

$0.457

Parana Technologies

USA . 2,013 parts In-Stock

1+ parts

$3.994

100+ parts

-

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$4.462

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2,013

$3.994

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$4.462

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DigiPath Technology Company

USA . 599 parts In-Stock

1+ parts

$4.398

100+ parts

$4.046

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-

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599

$4.398

$4.046

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ChromeModa Solutions

Germany . 2,676 parts In-Stock

1+ parts

$4.488

100+ parts

$3.680

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2,676

$4.488

$3.680

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IDEA Electronic Components Group

UK . 1,070 parts In-Stock

1+ parts

$4.488

100+ parts

-

1k+ parts

$4.039

10k+ parts

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1,070

$4.488

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$4.039

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AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$9.772

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305

$9.772

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One Stop Electronics

USA . 1,388 parts In-Stock

1+ parts

$42.500

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1,388

$42.500

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Component Stockers USA

USA . 309 parts In-Stock

1+ parts

$99.990

100+ parts

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309

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,078 parts In-Stock

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26,078

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Corphita

USA . 2,162 parts In-Stock

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2,162

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Microchip USA

USA . 110 parts In-Stock

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110

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Overview

Leverage the cutting-edge technology of Texas Instruments with the ADS58C28IRGC25 Line Driver & Receiver, offering unparalleled quality and reliability. Designed for industrial applications, this product delivers exceptional performance in challenging environments. With a compact design and advanced features, customers can trust in seamless operation and precision. Experience the value of superior engineering and innovation with the ADS58C28IRGC25 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.9 V

The high maximum supply voltage allows for compatibility with a wide range of systems and power sources.

No. of Functions: 2

Having multiple functions in one component adds versatility and efficiency to the design.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this product suitable for use in various environments and conditions.

Technical Specifications

Line Drivers & Receivers ADS58C28IRGC25 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

1.9 V

Minimum Supply Voltage-1:

1.75 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

ADS58C28IRGC25 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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