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ADS5562IRGZ25

Texas Instruments

ADS5562IRGZ25 by Texas Instruments

Texas Instruments ADS5562IRGZ25 is a 16-bit ADC with 0.013% EL, 80 MHz sample rate, and 3.56V max analog input voltage. Ideal for industrial applications requiring high-speed data conversion in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,645 parts In-Stock

1+ parts

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3,645

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Digiode

USA . 3,498 parts In-Stock

1+ parts

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3,498

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 860 parts In-Stock

1+ parts

$0.556

100+ parts

-

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860

$0.556

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Northwest PG Solutions

USA . 971 parts In-Stock

1+ parts

$0.612

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-

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971

$0.612

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AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$6.575

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395

$6.575

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Parana Technologies

USA . 1,828 parts In-Stock

1+ parts

$14.543

100+ parts

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1k+ parts

$14.982

10k+ parts

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1,828

$14.543

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$14.982

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ChromeModa Solutions

Germany . 3,070 parts In-Stock

1+ parts

$16.340

100+ parts

$13.399

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3,070

$16.340

$13.399

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

1+ parts

$16.340

100+ parts

$15.523

1k+ parts

$14.706

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1,427

$16.340

$15.523

$14.706

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One Stop Electronics

USA . 1,011 parts In-Stock

1+ parts

$26.000

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1,011

$26.000

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QUARKTWIN TECHNOLOGY LTD

USA . 4,046 parts In-Stock

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4,046

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Microchip USA

USA . 3,948 parts In-Stock

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3,948

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Corphita

USA . 3,698 parts In-Stock

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3,698

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DigiPath Technology Company

USA . 81 parts In-Stock

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$14.732

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81

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$14.732

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Overview

Unlock a world of precision and reliability with the ADS5562IRGZ25 by Texas Instruments. As leaders in analog-to-digital converters, Texas Instruments delivers cutting-edge technology that guarantees accuracy and efficiency in a variety of applications. From industrial automation to medical devices, this 16-bit ADC offers unparalleled performance with a maximum linearity error of just 0.013%. With a compact package design and wide operating temperature range, the ADS5562IRGZ25 provides unmatched value for customers seeking top-notch quality and seamless integration. Elevate your projects with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, allowing for easy handling and long-term reliability.

No. of Bits: 16

With 16 bits, this ADC can provide high resolution and accurate conversion of analog signals into digital data.

Power Supplies (V): 3.3

Operating at 3.3V, this ADC is suitable for low power applications, helping to conserve energy and reduce operating costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can withstand challenging environmental conditions, providing reliable performance in various industrial settings.

Sample Rate: 80 MHz

The high sample rate of 80 MHz allows for fast and efficient conversion of analog signals, making this ADC suitable for applications requiring real-time data processing.

Technical Specifications

Analog-to-Digital Converters ADS5562IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.013 %

Sample Rate:

80 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.56 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5562IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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