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ADS5547IRGZ25

Texas Instruments

ADS5547IRGZ25 by Texas Instruments

Texas Instruments' ADS5547IRGZ25 is a 14-bit ADC with 210 MHz sample rate and 0.0305% linearity error. Ideal for industrial applications, it operates at -40 to 85°C, with a 3.3V supply voltage and supports serial, parallel, and word output formats.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,948 parts In-Stock

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1,948

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Digiode

USA . 356 parts In-Stock

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356

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Distributors (Availability)

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Native Components

USA . 207 parts In-Stock

1+ parts

$0.162

100+ parts

-

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-

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$0.156

207

$0.162

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-

$0.156

Northwest PG Solutions

USA . 451 parts In-Stock

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$0.178

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-

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$0.157

451

$0.178

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$0.157

AZTECH Wire

Italy . 464 parts In-Stock

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$16.153

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464

$16.153

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One Stop Electronics

USA . 370 parts In-Stock

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$17.000

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370

$17.000

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Parana Technologies

USA . 171 parts In-Stock

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$22.010

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$22.551

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171

$22.010

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$22.551

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IDEA Electronic Components Group

UK . 1,793 parts In-Stock

1+ parts

$24.730

100+ parts

$23.494

1k+ parts

$22.257

10k+ parts

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1,793

$24.730

$23.494

$22.257

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ChromeModa Solutions

Germany . 555 parts In-Stock

1+ parts

$24.730

100+ parts

$20.279

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555

$24.730

$20.279

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Microchip USA

USA . 2,646 parts In-Stock

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Corphita

USA . 591 parts In-Stock

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DigiPath Technology Company

USA . 282 parts In-Stock

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$22.297

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282

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$22.297

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Overview

Unlock the power of precision with the Texas Instruments ADS5547IRGZ25 Analog-to-Digital Converter. Designed to deliver exceptional quality and reliability, this converter offers unparalleled accuracy with a maximum linearity error of just 0.0305%. Ideal for industrial applications, this converter boasts a sample rate of 210 MHz, making it perfect for demanding projects that require fast and precise data conversion. Trust in Texas Instruments to provide you with cutting-edge technology that will take your designs to the next level. Experience the value and benefits of the ADS5547IRGZ25 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable and rugged applications.

No. of Bits: 14

With a high resolution of 14 bits, this ADC offers precise and accurate conversion of analog signals into digital data, ensuring high-quality performance.

Maximum Operating Temperature: 85 °C

The wide maximum operating temperature range of 85°C makes this ADC suitable for use in various industrial environments without compromising its performance.

Sample Rate: 210 MHz

The high sample rate of 210 MHz allows for fast and efficient analog-to-digital conversion, making this product suitable for applications requiring real-time data processing.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The versatile output bit code options of offset binary and 2's complement binary provide flexibility in data representation, allowing for seamless integration with different systems.

Technical Specifications

Analog-to-Digital Converters ADS5547IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.0305 %

Sample Rate:

210 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5547IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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