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ADS5546IRGZRG4

Texas Instruments

ADS5546IRGZRG4 by Texas Instruments

Texas Instruments' ADS5546IRGZRG4 is a 14-bit ADC with 190 MHz sample rate, 0.0305% linearity error, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,609 parts In-Stock

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3,609

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Vyrian

USA . 2,573 parts In-Stock

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2,573

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 537 parts In-Stock

1+ parts

$1.350

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537

$1.350

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Northwest PG Solutions

USA . 2,210 parts In-Stock

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$1.485

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2,210

$1.485

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Parana Technologies

USA . 2,168 parts In-Stock

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$10.540

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$11.046

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2,168

$10.540

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$11.046

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DigiPath Technology Company

USA . 1,427 parts In-Stock

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$11.606

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1,427

$11.606

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ChromeModa Solutions

Germany . 4,802 parts In-Stock

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$11.843

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$9.711

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4,802

$11.843

$9.711

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

1+ parts

$11.843

100+ parts

$11.251

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$10.659

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2,028

$11.843

$11.251

$10.659

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One Stop Electronics

USA . 1,306 parts In-Stock

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$12.000

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1,306

$12.000

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$13.892

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$13.754

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$13.198

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$13.892

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AZTECH Wire

Italy . 707 parts In-Stock

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$17.125

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707

$17.125

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Component Stockers USA

USA . 740 parts In-Stock

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$99.990

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Corphita

USA . 3,419 parts In-Stock

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Microchip USA

USA . 392 parts In-Stock

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Overview

Unlock unparalleled precision and performance with the ADS5546IRGZRG4 by Texas Instruments. As a leader in Analog-to-Digital Converters, Texas Instruments delivers top-quality products that redefine industry standards. Ideal for industrial applications, this ADC offers a sample rate of 190 MHz and a maximum linearity error of 0.0305%, ensuring accurate and reliable data conversion. Experience the value of cutting-edge technology with the ADS5546IRGZRG4, providing customers with unmatched benefits and advantages in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the converter.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly.

No. of Bits: 14

Offers high resolution and accuracy for converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0305 %

Ensures precise and accurate conversion of analog input signals.

Power Supplies (V): 3.3

Compatible with common power supply voltages, making it easy to integrate into existing systems.

No. of Terminals: 48

Provides multiple connection points for input and output signals, enabling versatile use in different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the converter reliable and efficient.

Output Bit Code: BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY

Offers flexibility in choosing the output data format based on the specific requirements of the application.

Sample and Hold/Track and Hold: SAMPLE

Enables accurate sampling of analog signals at a high rate, ensuring precise digital conversion.

Technical Specifications

Analog-to-Digital Converters ADS5546IRGZRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0305 %

Sample Rate:

190 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5546IRGZRG4 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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