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ADS5527IRGZ25

Texas Instruments

ADS5527IRGZ25 by Texas Instruments

ADS5527IRGZ25 by Texas Instruments is a 12-bit ADC with 210 MHz sample rate, 0.0488% linearity error, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact chip carrier package with surface mount capability.

Median Price

$26.688

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$26.688

100+ parts

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150

$26.688

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Vyrian

USA . 7,460 parts In-Stock

1+ parts

-

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7,460

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Digiode

USA . 3,448 parts In-Stock

1+ parts

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3,448

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 243 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

-

10k+ parts

$0.360

243

$0.375

-

-

$0.360

Northwest PG Solutions

USA . 988 parts In-Stock

1+ parts

$0.412

100+ parts

-

1k+ parts

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10k+ parts

$0.364

988

$0.412

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-

$0.364

Parana Technologies

USA . 1,879 parts In-Stock

1+ parts

$16.902

100+ parts

-

1k+ parts

$17.139

10k+ parts

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1,879

$16.902

-

$17.139

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AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$18.026

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882

$18.026

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DigiPath Technology Company

USA . 1,578 parts In-Stock

1+ parts

$18.611

100+ parts

$17.122

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1,578

$18.611

$17.122

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IDEA Electronic Components Group

UK . 862 parts In-Stock

1+ parts

$18.991

100+ parts

$18.041

1k+ parts

$17.092

10k+ parts

-

862

$18.991

$18.041

$17.092

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ChromeModa Solutions

Germany . 783 parts In-Stock

1+ parts

$18.991

100+ parts

$15.573

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783

$18.991

$15.573

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One Stop Electronics

USA . 664 parts In-Stock

1+ parts

$22.000

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664

$22.000

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Component Stockers USA

USA . 211 parts In-Stock

1+ parts

$99.990

100+ parts

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211

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 6,200 parts In-Stock

1+ parts

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6,200

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Corphita

USA . 3,156 parts In-Stock

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3,156

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Microchip USA

USA . 1,003 parts In-Stock

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1,003

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Overview

Experience the revolution in data conversion with the ADS5527IRGZ25 by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments ensures top-notch quality and reliability in every product. This versatile converter is perfect for applications requiring high-speed and high-resolution performance. From industrial automation to medical imaging, the ADS5527IRGZ25 offers customers unparalleled value and benefits, delivering precise results with ease. Upgrade your systems today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 12

A higher number of bits results in better resolution and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0488 %

The low linearity error ensures accurate and reliable conversion of analog signals, making it suitable for precise measurement applications.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V allows for compatibility with a wide range of systems and power sources.

No. of Terminals: 48

Having a high number of terminals provides flexibility in connecting the converter to other components in a system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the converter can perform reliably in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the converter energy efficient and fast.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent operation of the converter.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the converter can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Analog-to-Digital Converters ADS5527IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

210 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5527IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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