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ADS54J66IRMPT

Texas Instruments

ADS54J66IRMPT by Texas Instruments

Texas Instruments ADS54J66IRMPT is a 14-bit ADC with 4 analog in channels, 500 MHz sample rate, and -45 to 85°C operating temperature range. Ideal for industrial applications requiring high-speed data conversion with a compact square chip carrier package.

Median Price

$557.960

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,198 parts In-Stock

1+ parts

$557.960

100+ parts

$505.050

1k+ parts

$481.000

10k+ parts

-

1,198

$557.960

$505.050

$481.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,912 parts In-Stock

1+ parts

$530.062

100+ parts

-

1k+ parts

-

10k+ parts

-

4,912

$530.062

-

-

-

Vyrian

USA . 8,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,906

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,543 parts In-Stock

1+ parts

$16.741

100+ parts

-

1k+ parts

$16.994

10k+ parts

-

1,543

$16.741

-

$16.994

-

AZTECH Wire

Italy . 359 parts In-Stock

1+ parts

$16.860

100+ parts

-

1k+ parts

-

10k+ parts

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359

$16.860

-

-

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DigiPath Technology Company

USA . 2,273 parts In-Stock

1+ parts

$18.434

100+ parts

-

1k+ parts

-

10k+ parts

-

2,273

$18.434

-

-

-

ChromeModa Solutions

Germany . 1,439 parts In-Stock

1+ parts

$18.810

100+ parts

$15.424

1k+ parts

-

10k+ parts

-

1,439

$18.810

$15.424

-

-

IDEA Electronic Components Group

UK . 269 parts In-Stock

1+ parts

$18.810

100+ parts

$17.870

1k+ parts

$16.929

10k+ parts

-

269

$18.810

$17.870

$16.929

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Ampacity Inc.

Singapore . 806 parts In-Stock

1+ parts

$474.270

100+ parts

-

1k+ parts

-

10k+ parts

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806

$474.270

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Corphita

USA . 3,928 parts In-Stock

1+ parts

$502.164

100+ parts

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3,928

$502.164

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Native Components

USA . 412 parts In-Stock

1+ parts

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100+ parts

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412

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Northwest PG Solutions

USA . 333 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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333

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Overview

Experience the superior quality and precision of Texas Instruments with the ADS54J66IRMPT Analog-to-Digital Converter. This innovative product offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. With 4 analog input channels and a sample rate of 500 MHz, this ADC ensures accurate and fast data conversion. Trust in Texas Instruments for cutting-edge technology and exceptional value that exceeds your expectations. Elevate your projects with the ADS54J66IRMPT and discover the difference TI can make.

Feature Benefit Bullets

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and throughput.

Surface Mount: YES

Being surface mountable makes installation and integration of this ADC easier and more convenient.

Package Shape: SQUARE

The square package shape provides uniformity and space efficiency in circuit board layout.

No. of Bits: 14

With 14 bits of resolution, this ADC can provide accurate and detailed conversion of analog signals.

No. of Terminals: 72

Having 72 terminals allows for a greater degree of connectivity and versatility in the setup of the ADC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensure efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range of 85°C makes this ADC suitable for industrial applications where heat may be a factor.

Minimum Operating Temperature: -45 °C

The low minimum operating temperature of -45°C allows this ADC to function reliably in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, enhancing the longevity of the product.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection in the circuit setup.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm allows for a compact overall design in the circuit layout.

Width: 10 mm

The 10 mm width offers a balance between space efficiency and ease of handling during installation.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables efficient soldering and assembly of the ADC.

Length: 10 mm

With a length of 10 mm, this ADC maintains a compact form factor suitable for various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this ADC can withstand harsh environmental conditions found in industrial settings.

Maximum Analog Input Voltage: 1.9 V

The maximum analog input voltage of 1.9 V allows for a wide range of input signal compatibility.

Sample Rate: 500 MHz

The high sample rate of 500 MHz enables fast and accurate conversion of analog signals.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process and reduces the risk of lead contamination.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary method of analog-to-digital conversion used in this ADC ensures unique features and performance capabilities.

Nominal Supply Voltage: 1.9 V

The nominal supply voltage of 1.9 V provides optimal power efficiency and compatibility with common power sources.

Output Bit Code: 2'S COMPLEMENT BINARY

The 2's complement binary output bit code simplifies digital signal processing and interpretation of the converted data.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for dense packing and efficient use of space in the circuit layout.

Minimum Analog Input Voltage: -1.9 V

The minimum analog input voltage of -1.9 V ensures compatibility with a wide range of input signals, including negative voltages.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with digital systems.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature enables accurate conversion of analog signals by capturing and maintaining the input signal during the conversion process.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Technical Specifications

Analog-to-Digital Converters ADS54J66IRMPT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Sample Rate:

500 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-1.9 V

Maximum Analog Input Voltage:

1.9 V

Nominal Supply Voltage:

1.9 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-45 °C (-49 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

72

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Trade Compliance

ADS54J66IRMPT Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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