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ADS54J60IRMP

Texas Instruments

ADS54J60IRMP by Texas Instruments

The Texas Instruments ADS54J60IRMP is a 16-bit ADC with 2 analog input channels, operating at a sample rate of 1000 MHz. It features a max analog input voltage of ±1.9V and outputs data in serial format. Ideal for industrial applications requiring high-speed and high-resolution analog-to-digital conversion.

Median Price

$766.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,183 parts In-Stock

1+ parts

$766.760

100+ parts

$694.050

1k+ parts

$661.000

10k+ parts

-

1,183

$766.760

$694.050

$661.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 162 parts In-Stock

1+ parts

$728.422

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-

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162

$728.422

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Vyrian

USA . 6,413 parts In-Stock

1+ parts

-

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6,413

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Chip Stock

USA . 351 parts In-Stock

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351

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Component Sense

UK . 46 parts In-Stock

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46

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Distributors (Availability)

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Parana Technologies

USA . 1,960 parts In-Stock

1+ parts

$17.473

100+ parts

-

1k+ parts

$17.668

10k+ parts

-

1,960

$17.473

-

$17.668

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ChromeModa Solutions

Germany . 5,705 parts In-Stock

1+ parts

$19.633

100+ parts

$16.099

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-

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5,705

$19.633

$16.099

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IDEA Electronic Components Group

UK . 1,144 parts In-Stock

1+ parts

$19.633

100+ parts

$18.651

1k+ parts

$17.670

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1,144

$19.633

$18.651

$17.670

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AZTECH Wire

Italy . 229 parts In-Stock

1+ parts

$20.600

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229

$20.600

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Native Components

USA . 952 parts In-Stock

1+ parts

$259.640

100+ parts

$254.447

1k+ parts

$251.851

10k+ parts

$249.254

952

$259.640

$254.447

$251.851

$249.254

Northwest PG Solutions

USA . 274 parts In-Stock

1+ parts

$285.604

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274

$285.604

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Ampacity Inc.

Singapore . 870 parts In-Stock

1+ parts

$651.750

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870

$651.750

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Corphita

USA . 4,058 parts In-Stock

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$690.084

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4,058

$690.084

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Lixinc

USA . 17,944 parts In-Stock

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17,944

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Authorized Procurement Solutions

USA . 3,600 parts In-Stock

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3,600

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 1,505 parts In-Stock

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1,505

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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DigiPath Technology Company

USA . 601 parts In-Stock

1+ parts

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100+ parts

$17.701

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601

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$17.701

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Overview

Experience unparalleled precision and performance with the ADS54J60IRMP Analog-to-Digital Converter by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that meet the highest standards. This ADC is ideal for a wide range of applications, offering customers exceptional value and benefits. With its advanced design and innovative features, the ADS54J60IRMP ensures accurate data conversion and reliable operation, making it the perfect choice for your project. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

No. of Analog In Channels : 2

Having 2 analog input channels allows for more flexibility in capturing and converting analog signals.

Surface Mount : YES

Surface mount technology makes it easier for PCB assembly and reduces overall size of the product.

Package Shape : SQUARE

Square package shape is more space-efficient and can be easily integrated into tight layouts.

No. of Bits : 16

16-bit resolution provides higher accuracy and precision in converting analog signals to digital.

No. of Terminals : 72

Having 72 terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter) : CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer versatility in thermal management and size constraints for different applications.

Maximum Operating Temperature : 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature : -40 °C

The low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Finish : NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position : QUAD

Quad terminal position allows for easy soldering and secure connections on the PCB.

Maximum Seated Height : 0.9 mm

The low seated height saves space and allows for compact designs.

Width : 10 mm

The compact width allows for easy integration into tight PCB layouts and space-constrained designs.

Maximum Time At Peak Reflow Temperature (s) : 30

The maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing process.

Peak Reflow Temperature °C : 260

High peak reflow temperature ensures proper soldering and reliability of the product during assembly.

Length : 10 mm

The compact length allows for space-saving integration into small electronic devices.

Temperature Grade : INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Maximum Analog Input Voltage : 1.9 V

High maximum analog input voltage allows for capturing a wide range of analog signals without saturation.

Sample Rate : 1000 MHz

High sample rate of 1000 MHz allows for fast and accurate conversion of analog signals to digital data.

Terminal Form : NO LEAD

No lead terminal form is environmentally friendly and complies with regulations.

Maximum Supply Current : 360 mA

High maximum supply current ensures stable operation and performance of the converter.

Converter Type : ADC, PROPRIETARY METHOD

The use of proprietary method in ADC conversion ensures high accuracy and performance in digital signal processing.

Nominal Supply Voltage : 1.9 V

The nominal supply voltage of 1.9 V is suitable for low-power applications and efficient energy usage.

Output Bit Code : OFFSET BINARY, 2'S COMPLEMENT BINARY

Having multiple output bit code formats allows for compatibility with various systems and devices.

Terminal Pitch : 0.5 mm

Fine terminal pitch of 0.5 mm allows for high density mounting and compact PCB design.

Minimum Analog Input Voltage : -1.9 V

Low minimum analog input voltage allows for capturing negative analog signals without distortion.

Output Format : SERIAL

Serial output format enables easy integration with serial communication interfaces for data transmission.

Moisture Sensitivity Level (MSL) : 3

MSL 3 rating ensures proper handling and storage of the product to prevent moisture-related damage.

Technical Specifications

Analog-to-Digital Converters ADS54J60IRMP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

1000 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.9 V

Maximum Analog Input Voltage:

1.9 V

Nominal Supply Voltage:

1.9 V

Maximum Supply Current:

360 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

72

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Trade Compliance

ADS54J60IRMP Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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