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ADS5481IRGC25

Texas Instruments

ADS5481IRGC25 by Texas Instruments

Texas Instruments' ADS5481IRGC25 is a 16-bit ADC with 0.0153% EL, 80 MHz sample rate, and 3V max analog input voltage. Ideal for industrial applications requiring high precision data conversion in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,514 parts In-Stock

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Digiode

USA . 802 parts In-Stock

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Native Components

USA . 960 parts In-Stock

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$0.052

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$0.050

960

$0.052

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$0.050

AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$9.559

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805

$9.559

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Parana Technologies

USA . 453 parts In-Stock

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$18.348

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$18.476

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453

$18.348

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DigiPath Technology Company

USA . 86 parts In-Stock

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$20.204

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86

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ChromeModa Solutions

Germany . 3,274 parts In-Stock

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$20.616

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$16.905

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$16.905

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IDEA Electronic Components Group

UK . 2,001 parts In-Stock

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$20.616

100+ parts

$19.585

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$18.554

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$20.616

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$18.554

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One Stop Electronics

USA . 1,298 parts In-Stock

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$35.000

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Component Stockers USA

USA . 364 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,952 parts In-Stock

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Corphita

USA . 4,041 parts In-Stock

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Northwest PG Solutions

USA . 1,396 parts In-Stock

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Microchip USA

USA . 187 parts In-Stock

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Overview

Unlock unparalleled precision and performance with the ADS5481IRGC25 by Texas Instruments. As a leading manufacturer in analog-to-digital converters, Texas Instruments delivers top-notch quality and reliability. This versatile chip carrier is perfect for industrial applications, offering a maximum linearity error of just 0.0153%. With a sample rate of 80 MHz and a wide operating temperature range, this ADC provides exceptional value and accuracy for your projects. Trust Texas Instruments to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the converter.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices.

No. of Bits: 16

The 16-bit resolution ensures high accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0153%

The low linearity error contributes to the overall precision and reliability of the conversion process.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages offers flexibility in different operating environments.

No. of Terminals: 64

Having 64 terminals enables efficient connectivity with other components in a circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles cater to different space constraints and thermal management needs in electronic designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in a wide range of conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold environments.

Terminal Position: QUAD

The quad terminal position simplifies connections and enhances signal integrity.

Maximum Seated Height: 1 mm

The low seated height contributes to a compact and space-efficient design.

Width: 9 mm

The compact width allows for easy integration into tight spaces in electronic assemblies.

Length: 9 mm

The small length further enhances the space-saving design of the converter.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh operating conditions.

Maximum Analog Input Voltage: 3 V

Support for an input voltage of up to 3V allows for versatile analog signal conversion.

Sample Rate: 80 MHz

The high sample rate of 80 MHz enables fast and accurate conversion of analog signals.

Technology: BIPOLAR

The use of bipolar technology helps in achieving high precision and accuracy in signal conversion.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process and enhances durability.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary method of analog-to-digital conversion offers unique features and performance advantages.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable operation and efficient power consumption.

Output Bit Code: OFFSET BINARY

The use of offset binary output bit code enhances accuracy and precision in digital data representation.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB space.

Minimum Analog Input Voltage: 0 V

Support for a minimum analog input voltage of 0V enables accurate conversion of low-level signals.

Output Format: PARALLEL, WORD

The parallel output format with word data representation simplifies interfacing with external devices.

Sample and Hold/Track and Hold: TRACK

The track-and-hold feature ensures accurate sampling of analog signals for precise digital conversion.

Technical Specifications

Analog-to-Digital Converters ADS5481IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0153 %

Sample Rate:

80 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

Trade Compliance

ADS5481IRGC25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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