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ADS5423MPJYEP

Texas Instruments

ADS5423MPJYEP by Texas Instruments

The Texas Instruments ADS5423MPJYEP is a 14-bit ADC with 80 MHz sample rate, ideal for military applications. It operates at temperatures from -55 to 125°C and supports input voltages from 0-2.2V. With a compact square package style and Gull Wing terminals, it offers high performance in a small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,895 parts In-Stock

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5,895

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Digiode

USA . 3,185 parts In-Stock

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3,185

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Distributors (Availability)

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AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$6.220

100+ parts

-

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257

$6.220

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Parana Technologies

USA . 854 parts In-Stock

1+ parts

$11.814

100+ parts

-

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$12.215

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854

$11.814

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$12.215

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DigiPath Technology Company

USA . 1,058 parts In-Stock

1+ parts

$13.009

100+ parts

$11.968

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1,058

$13.009

$11.968

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ChromeModa Solutions

Germany . 2,098 parts In-Stock

1+ parts

$13.274

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$10.885

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2,098

$13.274

$10.885

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IDEA Electronic Components Group

UK . 112 parts In-Stock

1+ parts

$13.274

100+ parts

$12.610

1k+ parts

$11.947

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112

$13.274

$12.610

$11.947

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One Stop Electronics

USA . 1,114 parts In-Stock

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$18.000

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1,114

$18.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,948 parts In-Stock

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29,948

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Northwest PG Solutions

USA . 2,032 parts In-Stock

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2,032

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Corphita

USA . 1,239 parts In-Stock

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1,239

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Native Components

USA . 757 parts In-Stock

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757

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Microchip USA

USA . 430 parts In-Stock

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430

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Overview

Unlock the power of precision with the ADS5423MPJYEP Analog-to-Digital Converter by Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers cutting-edge technology that meets the highest industry standards. Ideal for a wide range of applications, this converter offers unparalleled accuracy and reliability. Experience seamless integration, superior performance, and unmatched value with the ADS5423MPJYEP. Elevate your projects to new heights with Texas Instruments' industry-leading innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for a wide range of applications.

No. of Bits: 14

With a high number of bits, this ADC offers high resolution and accuracy in converting analog signals to digital, making it ideal for precision measurements and data acquisition.

Power Supplies (V): 3.3,5

The availability of multiple power supply options (3.3V and 5V) provides flexibility in powering the device, making it compatible with different systems and environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance of 125 °C ensures reliable performance even in harsh operating conditions, making it suitable for industrial and military applications.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method used in this product offers unique advantages such as improved accuracy, reduced noise, and enhanced performance compared to standard ADCs, making it a superior choice for demanding applications.

Technical Specifications

Analog-to-Digital Converters ADS5423MPJYEP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Sample Rate:

80 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

52

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Low Profile

Package Shape:

Package Equivalence Code:

HQFP52,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G52

Qualified:

No

Trade Compliance

ADS5423MPJYEP Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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