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ADS5423IPGP

Texas Instruments

ADS5423IPGP by Texas Instruments

ADC, PROPRIETARY METHOD; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: HTQFP; Package Shape: SQUARE;

Median Price

$84.961

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,427 parts In-Stock

1+ parts

$84.961

100+ parts

$75.521

1k+ parts

$55.530

10k+ parts

-

5,427

$84.961

$75.521

$55.530

-

Rochester

USA . 126 parts In-Stock

1+ parts

-

100+ parts

$79.460

1k+ parts

$71.090

10k+ parts

$66.910

126

-

$79.460

$71.090

$66.910

DigiKey

USA . 126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

126

-

-

-

-

Verical

USA . 126 parts In-Stock

1+ parts

-

100+ parts

$99.325

1k+ parts

$88.862

10k+ parts

$83.638

126

-

$99.325

$88.862

$83.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,873 parts In-Stock

1+ parts

$73.274

100+ parts

-

1k+ parts

-

10k+ parts

-

1,873

$73.274

-

-

-

Vyrian

USA . 5,589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,589

-

-

-

-

DigiKey Marketplace

USA . 126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

126

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,343 parts In-Stock

1+ parts

$20.462

100+ parts

-

1k+ parts

$20.516

10k+ parts

-

1,343

$20.462

-

$20.516

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$20.633

100+ parts

$18.776

1k+ parts

$16.919

10k+ parts

-

500

$20.633

$18.776

$16.919

-

DigiPath Technology Company

USA . 2,119 parts In-Stock

1+ parts

$22.531

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$22.531

-

-

-

ChromeModa Solutions

Germany . 6,443 parts In-Stock

1+ parts

$22.991

100+ parts

$18.853

1k+ parts

-

10k+ parts

-

6,443

$22.991

$18.853

-

-

IDEA Electronic Components Group

UK . 894 parts In-Stock

1+ parts

$22.991

100+ parts

$21.841

1k+ parts

$20.692

10k+ parts

-

894

$22.991

$21.841

$20.692

-

Corphita

USA . 4,691 parts In-Stock

1+ parts

$69.417

100+ parts

-

1k+ parts

-

10k+ parts

-

4,691

$69.417

-

-

-

Vigor

Singapore . 154 parts In-Stock

1+ parts

$74.700

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$74.700

-

-

-

Corohmni

South Africa . 486 parts In-Stock

1+ parts

$76.410

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$76.410

-

-

-

Component Stockers USA

USA . 4,495 parts In-Stock

1+ parts

$79.310

100+ parts

$74.550

1k+ parts

$59.810

10k+ parts

-

4,495

$79.310

$74.550

$59.810

-

Northwest PG Solutions

USA . 2,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,102

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Native Components

USA . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Technical Specifications

Analog-to-Digital Converters ADS5423IPGP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Sample Rate:

80 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

410 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

52

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile

Package Shape:

Package Equivalence Code:

TQFP52,.47SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G52

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5423IPGP Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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