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ADS5411IPJYG3

Texas Instruments

ADS5411IPJYG3 by Texas Instruments

Texas Instruments ADS5411IPJYG3 is an 11-bit ADC with 0.0244% EL, 105 MHz sample rate, and 2.2V max analog input voltage. Ideal for industrial applications requiring high-speed data conversion in a compact package with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,940 parts In-Stock

1+ parts

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5,940

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Digiode

USA . 2,696 parts In-Stock

1+ parts

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2,696

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 44 parts In-Stock

1+ parts

$1.165

100+ parts

-

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44

$1.165

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Northwest PG Solutions

USA . 1,978 parts In-Stock

1+ parts

$1.282

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-

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1,978

$1.282

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Parana Technologies

USA . 745 parts In-Stock

1+ parts

$5.781

100+ parts

-

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$6.573

10k+ parts

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745

$5.781

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$6.573

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DigiPath Technology Company

USA . 910 parts In-Stock

1+ parts

$6.365

100+ parts

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910

$6.365

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ChromeModa Solutions

Germany . 946 parts In-Stock

1+ parts

$6.495

100+ parts

$5.326

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946

$6.495

$5.326

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IDEA Electronic Components Group

UK . 316 parts In-Stock

1+ parts

$6.495

100+ parts

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1k+ parts

$5.846

10k+ parts

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316

$6.495

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$5.846

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AZTECH Wire

Italy . 481 parts In-Stock

1+ parts

$14.332

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481

$14.332

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One Stop Electronics

USA . 1,562 parts In-Stock

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$20.000

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1,562

$20.000

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Authorized Procurement Solutions

USA . 3,700 parts In-Stock

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3,700

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Microchip USA

USA . 3,314 parts In-Stock

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3,314

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QUARKTWIN TECHNOLOGY LTD

USA . 2,615 parts In-Stock

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2,615

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Corphita

USA . 1,594 parts In-Stock

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1,594

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Overview

Unlock the power of precision with the ADS5411IPJYG3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality Analog-to-Digital Converters that provide unparalleled accuracy and reliability. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. Experience seamless performance and enhanced efficiency with the ADS5411IPJYG3, setting new standards in data conversion technology. Elevate your projects with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, making it a good choice for applications where weight and cost are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Bits: 11

With 11 bits resolution, this ADC provides accurate conversion of analog signals into digital, making it suitable for applications that require high precision.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures accurate conversion and reliability in the output data, making it a reliable choice for sensitive applications.

Power Supplies (V): 3.3,5

Supporting multiple power supply voltages allows for flexibility in different system configurations, making it adaptable to various design requirements.

No. of Terminals: 52

Having a high number of terminals provides ample connectivity options, enabling the ADC to interface with multiple input/output signals efficiently.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE

The variety of package styles offers versatility in mounting and thermal management, making it suitable for different application environments.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the ADC can function reliably in harsh environmental conditions, increasing its suitability for industrial use.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the ADC to operate in extreme cold temperatures, making it suitable for outdoor or industrial applications in cold environments.

Terminal Position: QUAD

The quad terminal position simplifies the PCB layout and facilitates easy soldering, enhancing the ease of assembly and reliability of the product.

Width: 10 mm

The compact width makes the ADC suitable for space-constrained applications where size is a critical factor.

Converter Type: ADC, PROPRIETARY METHOD

Utilizing a proprietary conversion method ensures optimized performance and accuracy, making the ADC stand out in terms of functionality and reliability.

Technical Specifications

Analog-to-Digital Converters ADS5411IPJYG3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

11

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

105 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

52

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Low Profile

Package Shape:

Package Equivalence Code:

QFP52,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G52

Qualified:

No

Trade Compliance

ADS5411IPJYG3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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