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ADS5282IRGCR

Texas Instruments

ADS5282IRGCR by Texas Instruments

Texas Instruments ADS5282IRGCR is a 12-bit ADC with 8 analog in channels, 65 MHz sample rate, and 0.0415% max linearity error. Ideal for industrial applications, it operates b/w -40 to 85°C, with a supply voltage of 3.3V and max analog input voltage of ±2V.

Median Price

$89.566

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,120 parts In-Stock

1+ parts

$89.566

100+ parts

$79.614

1k+ parts

$58.540

10k+ parts

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7,120

$89.566

$79.614

$58.540

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 657 parts In-Stock

1+ parts

$85.088

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657

$85.088

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Vyrian

USA . 2,742 parts In-Stock

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2,742

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Chip Stock

USA . 535 parts In-Stock

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535

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Connector Distribution Corp

USA . 100 parts In-Stock

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100

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Right Parts Inc.

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$12.830

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-

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215

$12.830

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Parana Technologies

USA . 1,375 parts In-Stock

1+ parts

$16.244

100+ parts

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$16.557

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1,375

$16.244

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$16.557

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DigiPath Technology Company

USA . 532 parts In-Stock

1+ parts

$17.887

100+ parts

$16.456

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532

$17.887

$16.456

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ChromeModa Solutions

Germany . 3,748 parts In-Stock

1+ parts

$18.252

100+ parts

$14.967

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3,748

$18.252

$14.967

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IDEA Electronic Components Group

UK . 746 parts In-Stock

1+ parts

$18.252

100+ parts

$17.339

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$16.427

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746

$18.252

$17.339

$16.427

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Corphita

USA . 2,177 parts In-Stock

1+ parts

$80.609

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2,177

$80.609

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Native Components

USA . 960 parts In-Stock

1+ parts

$206.730

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$198.461

960

$206.730

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$198.461

Northwest PG Solutions

USA . 1,403 parts In-Stock

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$227.403

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1,403

$227.403

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QUARKTWIN TECHNOLOGY LTD

USA . 17,783 parts In-Stock

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17,783

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Overview

Experience high-quality analog-to-digital conversion with the ADS5282IRGCR by Texas Instruments, a leading manufacturer in the industry. Ideal for a wide range of applications, this converter offers exceptional precision and reliability. With its compact design and advanced technology, customers can enjoy the benefits of fast sampling rates and low power consumption. Upgrade your projects with the ADS5282IRGCR and unlock unparalleled performance and value.

Feature Benefit Bullets

No. of Analog In Channels: 8

Having 8 analog input channels allows for multiple signals to be converted simultaneously, making this ADC suitable for applications requiring high channel count.

No. of Bits: 12

With 12 bits resolution, this ADC provides a good level of accuracy in converting analog signals to digital values.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85°C makes this ADC suitable for industrial applications where temperature fluctuations can occur.

Sample Rate: 65 MHz

A high sample rate of 65 MHz allows for fast and efficient conversion of analog signals to digital, making this ADC suitable for applications requiring high-speed data acquisition.

Output Format: SERIAL

The serial output format simplifies interfacing with other digital systems, making this ADC versatile and easy to integrate into various digital circuits.

Technical Specifications

Analog-to-Digital Converters ADS5282IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0415 %

Sample Rate:

65 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

170 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5282IRGCR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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