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ADS5232IPAGTG4

Texas Instruments

ADS5232IPAGTG4 by Texas Instruments

Texas Instruments ADS5232IPAGTG4 is a 12-bit ADC with 65 MHz sample rate, 0.061% linearity error, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,458 parts In-Stock

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4,458

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Digiode

USA . 1,698 parts In-Stock

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1,698

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Distributors (Availability)

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Native Components

USA . 735 parts In-Stock

1+ parts

$1.100

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735

$1.100

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Northwest PG Solutions

USA . 792 parts In-Stock

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$1.211

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792

$1.211

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One Stop Electronics

USA . 343 parts In-Stock

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$11.000

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343

$11.000

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AZTECH Wire

Italy . 313 parts In-Stock

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$15.845

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313

$15.845

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Parana Technologies

USA . 1,498 parts In-Stock

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$20.242

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$20.230

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1,498

$20.242

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$20.230

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DigiPath Technology Company

USA . 196 parts In-Stock

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$22.289

100+ parts

$20.506

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196

$22.289

$20.506

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ChromeModa Solutions

Germany . 2,254 parts In-Stock

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$22.744

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$18.650

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$22.744

$18.650

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IDEA Electronic Components Group

UK . 361 parts In-Stock

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$22.744

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$21.607

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$20.470

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361

$22.744

$21.607

$20.470

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Corphita

USA . 686 parts In-Stock

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Microchip USA

USA . 428 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the ADS5232IPAGTG4 by Texas Instruments, a game-changing Analog-to-Digital Converter that embodies quality and innovation. Manufactured by the industry leader, this product offers unmatched precision and reliability in converting analog signals to digital data. Ideal for a wide range of applications, this converter delivers exceptional performance and accuracy, making it a must-have for professionals seeking top-tier solutions. Elevate your projects with the ADS5232IPAGTG4 and experience the next level of efficiency and effectiveness.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and makes the product resistant to external factors like moisture and shocks.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having 2 functions in one device offers versatility and potential cost savings by integrating multiple functions into a single component.

No. of Bits: 12

The 12-bit resolution provides high accuracy and precision in digital conversion, ensuring reliable and consistent data output.

Power Supplies (V): 3.3

Operating at 3.3V makes this product suitable for low-power applications, helping to conserve energy and extend battery life.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, ensuring reliable performance in various applications.

Sample Rate: 65 MHz

The high sample rate of 65 MHz enables fast and efficient data conversion, making this product ideal for applications requiring real-time processing.

Technology: CMOS

Using CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of digital systems, making it a versatile and efficient choice.

Technical Specifications

Analog-to-Digital Converters ADS5232IPAGTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

65 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.02 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

4

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP64,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5232IPAGTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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