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ADS5203IPFBG4

Texas Instruments

ADS5203IPFBG4 by Texas Instruments

ADS5203IPFBG4 by Texas Instruments is a 10-bit ADC with 2 analog in channels, operating at a sample rate of 40 MHz. It features a max linearity error of 0.1465% and supports industrial temperature grades. Ideal for applications requiring high-speed and accurate analog-to-digital conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,399 parts In-Stock

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Digiode

USA . 4,096 parts In-Stock

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4,096

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Distributors (Availability)

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One Stop Electronics

USA . 230 parts In-Stock

1+ parts

$5.000

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230

$5.000

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Native Components

USA . 159 parts In-Stock

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$8.766

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159

$8.766

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Parana Technologies

USA . 2,178 parts In-Stock

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$9.119

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$9.771

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2,178

$9.119

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$9.771

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Northwest PG Solutions

USA . 877 parts In-Stock

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$9.643

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$8.678

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877

$9.643

$8.678

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AZTECH Wire

Italy . 791 parts In-Stock

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$9.666

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791

$9.666

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$10.041

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$9.238

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1,384

$10.041

$9.238

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ChromeModa Solutions

Germany . 1,934 parts In-Stock

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$10.246

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$8.402

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1,934

$10.246

$8.402

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IDEA Electronic Components Group

UK . 713 parts In-Stock

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$10.246

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$9.734

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$9.221

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713

$10.246

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$9.221

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Component Stockers USA

USA . 719 parts In-Stock

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$99.990

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719

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,312 parts In-Stock

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Microchip USA

USA . 7,772 parts In-Stock

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Corphita

USA . 2,041 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the ADS5203IPFBG4 by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers exceptional performance in every product they create. The ADS5203IPFBG4 is a game-changer in the Analog-to-Digital Converters category, offering unparalleled precision and reliability. With its sleek design and advanced features, this converter is perfect for a wide range of applications. Experience the value and benefits of Texas Instruments' cutting-edge technology with the ADS5203IPFBG4. Upgrade your systems today and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Analog-to-Digital Converter, ensuring a longer lifespan and reliable performance.

No. of Analog In Channels: 2

Allows for multiple input channels, making this ADC suitable for applications that require the conversion of signals from different sources simultaneously.

Surface Mount: YES

Enables easy and efficient installation onto circuit boards, saving time and effort during the manufacturing process.

No. of Bits: 10

Provides a higher resolution of analog-to-digital conversion, allowing for more accurate and detailed digital representation of the input signals.

Maximum Linearity Error (EL): 0.1465 %

Ensures accurate and precise conversion of analog signals to digital, reducing errors and maintaining signal integrity.

Power Supplies (V): 3.3

Operates at a standard voltage level, making it compatible with various electronic systems and power sources.

No. of Terminals: 48

Provides sufficient connectivity options for interfacing with other components and systems in a circuit.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that may require operation in high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Offers reliable performance even in extreme cold temperatures, ensuring functionality in a wide range of operating conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption, making it energy-efficient and suitable for battery-powered devices.

Sample Rate: 40 MHz

Provides high-speed sampling capabilities, enabling real-time conversion of analog signals into digital data.

Technical Specifications

Analog-to-Digital Converters ADS5203IPFBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1465 %

Sample Rate:

40 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-1 V

Maximum Analog Input Voltage:

1 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5203IPFBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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