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ADS42JB69IRGCR

Texas Instruments

ADS42JB69IRGCR by Texas Instruments

Texas Instruments ADS42JB69IRGCR is a 16-bit ADC with 2 analog in channels, 250 MHz sample rate, and 0.0122% linearity error. Ideal for industrial applications, it operates b/w -40 to 85°C with a supply voltage of 1.8V or 3.3V. Package style includes chip carrier and very thin profile heat sink.

Median Price

$207.733

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,856 parts In-Stock

1+ parts

$207.733

100+ parts

$188.034

1k+ parts

$179.080

10k+ parts

-

3,856

$207.733

$188.034

$179.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,682 parts In-Stock

1+ parts

$197.346

100+ parts

-

1k+ parts

-

10k+ parts

-

1,682

$197.346

-

-

-

Vyrian

USA . 2,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,537

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 870 parts In-Stock

1+ parts

$0.162

100+ parts

-

1k+ parts

-

10k+ parts

$0.156

870

$0.162

-

-

$0.156

Northwest PG Solutions

USA . 1,301 parts In-Stock

1+ parts

$0.178

100+ parts

-

1k+ parts

-

10k+ parts

$0.157

1,301

$0.178

-

-

$0.157

Parana Technologies

USA . 591 parts In-Stock

1+ parts

$13.451

100+ parts

-

1k+ parts

$13.969

10k+ parts

-

591

$13.451

-

$13.969

-

DigiPath Technology Company

USA . 1,759 parts In-Stock

1+ parts

$14.811

100+ parts

$13.626

1k+ parts

-

10k+ parts

-

1,759

$14.811

$13.626

-

-

ChromeModa Solutions

Germany . 2,260 parts In-Stock

1+ parts

$15.113

100+ parts

$12.393

1k+ parts

-

10k+ parts

-

2,260

$15.113

$12.393

-

-

IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$15.113

100+ parts

$14.357

1k+ parts

$13.602

10k+ parts

-

1,092

$15.113

$14.357

$13.602

-

AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$21.720

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$21.720

-

-

-

Corphita

USA . 74 parts In-Stock

1+ parts

$186.960

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$186.960

-

-

-

Microchip USA

USA . 2,005 parts In-Stock

1+ parts

$228.330

100+ parts

$222.240

1k+ parts

$219.190

10k+ parts

$216.150

2,005

$228.330

$222.240

$219.190

$216.150

Overview

Experience unparalleled precision and performance with the Texas Instruments ADS42JB69IRGCR Analog-to-Digital Converter. Crafted with superior quality and cutting-edge technology, this converter delivers unmatched accuracy and efficiency in a wide range of applications. Whether you're designing medical equipment, industrial automation systems, or telecommunications devices, this product offers exceptional value, reliability, and versatility. Trust Texas Instruments to elevate your projects to new heights with the ADS42JB69IRGCR Analog-to-Digital Converter.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the ADC, ensuring long-term reliability.

No. of Analog In Channels: 2

Allows for the conversion of two analog signals simultaneously, increasing efficiency and flexibility.

Surface Mount: YES

Facilitates easy and secure mounting on circuit boards, simplifying the manufacturing process.

Package Shape: SQUARE

Enables efficient use of space on a circuit board, maximizing design flexibility.

No. of Bits: 16

Provides high resolution and accuracy in converting analog signals to digital, ensuring precise data conversion.

Maximum Linearity Error (EL): 0.0122%

Ensures minimal distortion and error in the converted digital output, maintaining data accuracy.

Power Supplies (V): 1.8,3.3

Compatible with a range of standard power supply voltages, making it versatile for different applications.

No. of Terminals: 64

Offers multiple connection points for easy integration and communication with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides options for different package styles to suit various design requirements.

Maximum Operating Temperature: 85 °C

Allows the ADC to operate reliably in a wide range of temperature conditions.

Minimum Operating Temperature: -40 °C

Ensures the ADC can function effectively in low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Delivers corrosion resistance and strong electrical conductivity for efficient data transmission.

Terminal Position: QUAD

Facilitates easy connection and integration within a circuit board layout.

Maximum Seated Height: 1 mm

Helps achieve a compact and streamlined design for the overall system.

Width: 9 mm

Contributes to the overall compact size of the ADC, making it suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly, maintaining product quality.

Peak Reflow Temperature °C: 260

Allows for high-temperature reflow soldering, ensuring secure and durable connections.

Length: 9 mm

Corresponds to the width dimensions, contributing to the compact form factor of the ADC.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions and requirements.

Maximum Analog Input Voltage: 2.5 V

Can handle a wide range of input voltages, accommodating different analog signal levels.

Sample Rate: 250 MHz

Enables high-speed data conversion, ideal for applications that require rapid processing.

Terminal Form: NO LEAD

Reduces the risk of lead contamination and aligns with modern environmental standards.

Maximum Supply Current: 160 mA

Indicates a low power consumption level, suitable for energy-efficient applications.

Converter Type: ADC, PROPRIETARY METHOD

Utilizes a specialized conversion method, potentially offering improved performance and reliability compared to standard ADCs.

Nominal Supply Voltage: 1.8 V

Indicates the standard operating voltage for the ADC, ensuring consistent performance.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Supports different output coding formats to match specific system requirements.

Terminal Pitch: 0.5 mm

Provides a fine pitch for compact spacing of terminals, optimizing board layout.

Minimum Analog Input Voltage: -2.5 V

Accommodates a wide range of negative input voltages, expanding compatibility with various input signals.

Output Format: SERIAL

Facilitates serial data output, suitable for interfacing with microcontrollers and other digital systems.

Sample and Hold/Track and Hold: SAMPLE

Utilizes a sample-and-hold mechanism for accurate data acquisition and conversion.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling.

Technical Specifications

Analog-to-Digital Converters ADS42JB69IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0122 %

Sample Rate:

250 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

-2.5 V

Maximum Analog Input Voltage:

2.5 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

160 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS42JB69IRGCR Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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