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ADS4229IRGCR

Texas Instruments

ADS4229IRGCR by Texas Instruments

The Texas Instruments ADS4229IRGCR is a 12-bit ADC with 2 analog input channels, operating at a sample rate of 250 MHz. It features a max linearity error of 0.0977% and operates on a supply voltage of 1.8V. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion in compact designs.

Median Price

$48.279

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,802 parts In-Stock

1+ parts

$48.279

100+ parts

$46.827

1k+ parts

$36.300

10k+ parts

-

13,802

$48.279

$46.827

$36.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,232 parts In-Stock

1+ parts

$45.865

100+ parts

-

1k+ parts

-

10k+ parts

-

4,232

$45.865

-

-

-

Vyrian

USA . 3,027 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,027

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 831 parts In-Stock

1+ parts

$0.352

100+ parts

-

1k+ parts

-

10k+ parts

$0.338

831

$0.352

-

-

$0.338

Northwest PG Solutions

USA . 1,817 parts In-Stock

1+ parts

$0.387

100+ parts

-

1k+ parts

-

10k+ parts

$0.342

1,817

$0.387

-

-

$0.342

Parana Technologies

USA . 1,103 parts In-Stock

1+ parts

$9.023

100+ parts

-

1k+ parts

$9.690

10k+ parts

-

1,103

$9.023

-

$9.690

-

IDEA Electronic Components Group

UK . 1,491 parts In-Stock

1+ parts

$10.138

100+ parts

$9.631

1k+ parts

$9.124

10k+ parts

-

1,491

$10.138

$9.631

$9.124

-

ChromeModa Solutions

Germany . 726 parts In-Stock

1+ parts

$10.138

100+ parts

$8.313

1k+ parts

-

10k+ parts

-

726

$10.138

$8.313

-

-

AZTECH Wire

Italy . 309 parts In-Stock

1+ parts

$17.330

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$17.330

-

-

-

Corphita

USA . 1,030 parts In-Stock

1+ parts

$43.451

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$43.451

-

-

-

Lixinc

USA . 13,472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,472

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,945

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

Metaverse IC Inc.

Canada . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

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Kepictronics

USA . 1,902 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,902

-

-

-

-

DigiPath Technology Company

USA . 210 parts In-Stock

1+ parts

-

100+ parts

$9.140

1k+ parts

-

10k+ parts

-

210

-

$9.140

-

-

Overview

Experience the seamless conversion and precision of the ADS4229IRGCR Analog-to-Digital Converter by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This versatile device with 2 analog input channels is ideal for various applications, offering customers unparalleled value and performance. Unlock the potential of your projects with the ADS4229IRGCR and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Analog In Channels: 2

Allows for multiple analog signals to be converted simultaneously, increasing efficiency and versatility.

Surface Mount: YES

Facilitates easy installation onto circuit boards, saving time and effort during assembly.

No. of Bits: 12

Offers a high resolution for accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0977 %

Ensures precision and accuracy in the conversion process, resulting in reliable digital output.

Power Supplies (V): 1.8

Operates at a low voltage, reducing power consumption and heat generation for energy efficiency.

No. of Terminals: 64

Provides ample connectivity options for integrating the converter into various electronic systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple packaging options to suit different space and heat dissipation requirements in electronic designs.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, increasing the product's versatility.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for use in a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring stable connections for optimal performance.

Terminal Position: QUAD

Facilitates easy soldering and connection to the circuit board, simplifying the installation process.

Maximum Seated Height: 1 mm

Has a low profile design, saving space on the circuit board and allowing for compact electronic devices.

Width: 9 mm

Compact size enables easy integration into electronic systems with limited space available.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering of the converter during assembly, reducing manufacturing time and costs.

Peak Reflow Temperature °C: 260

Withstands high temperatures during the soldering process, ensuring reliable connections.

Length: 9 mm

Compact size enables easy integration into electronic systems with limited space available.

Temperature Grade: INDUSTRIAL

Designed to meet the temperature requirements of industrial applications, ensuring reliable performance in harsh environments.

Maximum Analog Input Voltage: 2 V

Allows for a wide range of analog input signals to be converted into digital data.

Sample Rate: 250 MHz

Provides fast and efficient conversion of analog signals, suitable for high-speed applications.

Terminal Form: NO LEAD

Lead-free terminals for environmental compliance and safe handling during the manufacturing process.

Maximum Supply Current: 190 mA

Operates at a low current, reducing power consumption and heat generation for energy efficiency.

Converter Type: ADC, FLASH METHOD

Utilizes flash conversion technology for high-speed and accurate analog-to-digital conversion.

Nominal Supply Voltage: 1.8 V

Operates efficiently at a low voltage, reducing power consumption and heat generation.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Provides flexibility in choosing the output format based on the specific requirements of the application.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable compact layout and space-saving design on the circuit board.

Minimum Analog Input Voltage: -2 V

Allows for a wide range of analog input signals to be converted into digital data.

Output Format: PARALLEL, WORD

Supports multiple output formats for compatibility with different digital systems and interfaces.

Sample and Hold/Track and Hold: SAMPLE

Utilizes sample and hold technique for accurate conversion of varying analog signals.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture during storage and operation, ensuring long-term reliability.

Technical Specifications

Analog-to-Digital Converters ADS4229IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

250 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

190 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS4229IRGCR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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