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ADS4129IRGZ25

Texas Instruments

ADS4129IRGZ25 by Texas Instruments

The Texas Instruments ADS4129IRGZ25 is a 12-bit ADC with 250 MHz sample rate and 0.1221% linearity error. Ideal for industrial applications, it operates b/w -40 to 85°C, with a supply voltage of 1.8V. The converter features offset binary output and comes in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,514 parts In-Stock

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Digiode

USA . 1,464 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,598 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 876 parts In-Stock

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$15.756

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Parana Technologies

USA . 750 parts In-Stock

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$20.709

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$20.836

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750

$20.709

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$20.836

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DigiPath Technology Company

USA . 440 parts In-Stock

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$22.803

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440

$22.803

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ChromeModa Solutions

Germany . 4,321 parts In-Stock

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$23.268

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$19.080

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4,321

$23.268

$19.080

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IDEA Electronic Components Group

UK . 1,749 parts In-Stock

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$23.268

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$22.105

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$20.941

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1,749

$23.268

$22.105

$20.941

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QUARKTWIN TECHNOLOGY LTD

USA . 24,440 parts In-Stock

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Corphita

USA . 3,718 parts In-Stock

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Microchip USA

USA . 3,701 parts In-Stock

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Northwest PG Solutions

USA . 2,310 parts In-Stock

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$3.801

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Native Components

USA . 888 parts In-Stock

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$3.762

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Overview

Unleash the power of precision with the ADS4129IRGZ25 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings unparalleled quality and reliability to its Analog-to-Digital Converters. Ideal for industrial applications, this 12-bit converter offers a sample rate of 250 MHz and a maximum linearity error of just 0.1221%, ensuring accurate and efficient performance. Experience the benefits of high-speed data conversion and seamless integration with the ADS4129IRGZ25, setting new standards in signal processing technology. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy assembly onto circuit boards, making the product suitable for high-volume production and automated assembly processes.

No. of Bits: 12

With 12 bits resolution, the converter can provide high accuracy in converting analog signals to digital data, making it suitable for applications that require precise measurements.

Power Supplies (V): 1.8

Operating at a low power supply voltage of 1.8V makes the product energy-efficient and suitable for battery-powered devices or applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand a wide range of temperature conditions, making it suitable for industrial applications with varying operating environments.

Technical Specifications

Analog-to-Digital Converters ADS4129IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1221 %

Sample Rate:

250 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS4129IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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