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ADS1287DIRHBT

Texas Instruments

ADS1287DIRHBT by Texas Instruments

Texas Instruments ADS1287DIRHBT is a 24-bit ADC with 2 analog in channels, operating from -40 to 85°C. It has a sample rate of 0.001 MHz and outputs data in serial binary format. Ideal for industrial applications requiring precise analog-to-digital conversion in compact square chip carrier packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,730 parts In-Stock

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8,730

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Digiode

USA . 2,981 parts In-Stock

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2,981

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Distributors (Availability)

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Native Components

USA . 421 parts In-Stock

1+ parts

$0.447

100+ parts

-

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$0.429

421

$0.447

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$0.429

Northwest PG Solutions

USA . 660 parts In-Stock

1+ parts

$0.491

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-

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$0.433

660

$0.491

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$0.433

AZTECH Wire

Italy . 444 parts In-Stock

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$5.680

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444

$5.680

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One Stop Electronics

USA . 546 parts In-Stock

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$16.000

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546

$16.000

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Parana Technologies

USA . 320 parts In-Stock

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$18.524

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$18.636

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320

$18.524

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$18.636

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DigiPath Technology Company

USA . 1,409 parts In-Stock

1+ parts

$20.397

100+ parts

$18.765

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1,409

$20.397

$18.765

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ChromeModa Solutions

Germany . 2,236 parts In-Stock

1+ parts

$20.813

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$17.067

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$20.813

$17.067

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IDEA Electronic Components Group

UK . 709 parts In-Stock

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$20.813

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$19.772

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$18.732

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709

$20.813

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$18.732

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Microchip USA

USA . 2,305 parts In-Stock

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Corphita

USA . 884 parts In-Stock

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Overview

Discover the superior quality and precision of the ADS1287DIRHBT by Texas Instruments, a leading manufacturer in the industry. This Analog-to-Digital Converter offers unparalleled performance with 24 bits of resolution and 2 analog input channels, making it ideal for a wide range of applications. From industrial automation to medical devices, this versatile chip carrier package provides reliable and accurate conversion, ensuring your designs operate flawlessly. Trust Texas Instruments to deliver innovation that exceeds expectations and unlocks endless possibilities for your projects. Unlock the power of cutting-edge technology with the ADS1287DIRHBT today!

Feature Benefit Bullets

No. of Analog In Channels: 2

Having 2 analog input channels allows for the conversion of 2 separate analog signals simultaneously, providing versatility in data acquisition.

Surface Mount: YES

Being surface mountable makes this product easy to integrate onto circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy positioning within a layout.

No. of Bits: 24

With 24 bits of resolution, this ADC can provide highly accurate digital representations of analog input signals.

No. of Terminals: 32

Having 32 terminals allows for connectivity to multiple external components, expanding the functionality of the device.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and robust housing for the ADC, enhancing durability and ease of handling.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage requirement enables operation in low-power or portable device applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows for use in both hot and cold temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for secure soldering connections, reducing the risk of signal loss or disconnection.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps prevent overheating during assembly, ensuring product integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables robust soldering processes for secure component attachment.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Maximum Analog Input Voltage: 2.5 V

The high maximum analog input voltage allows for the conversion of a wide range of analog input signals without risking damage to the ADC.

Sample Rate: 0.001 MHz

With a high sample rate, this ADC can accurately capture and convert fast-changing analog signals, suitable for demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and reduces the risk of lead-related environmental hazards.

Converter Type: ADC, DELTA-SIGMA

The delta-sigma converter type offers high resolution and low noise performance, ideal for precision measurement applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage provides stable power to the ADC, ensuring reliable and consistent operation.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and analysis, making it compatible with standard digital systems.

Output Format: SERIAL

The serial output format allows for easy integration with microcontrollers and digital interfaces, simplifying data transmission.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, requiring standard handling precautions during assembly and storage.

Technical Specifications

Analog-to-Digital Converters ADS1287DIRHBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

24

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

1 kHz

Electrical Specifications

Maximum Analog Input Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.25 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Surface Mount:

Yes

Packaging

Package Style:

Chip Carrier

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Trade Compliance

ADS1287DIRHBT Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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