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ADS1285IRHBR

Texas Instruments

ADS1285IRHBR by Texas Instruments

Texas Instruments ADS1285IRHBR is a 32-bit ADC with 2 analog in channels, operating from -40 to 85°C. It features a sample rate of 0.004 MHz and output format is serial. Ideal for applications requiring high-resolution analog-to-digital conversion in compact spaces.

Median Price

$67.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 47,660 parts In-Stock

1+ parts

$67.320

100+ parts

$59.840

1k+ parts

$44.000

10k+ parts

-

47,660

$67.320

$59.840

$44.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 936 parts In-Stock

1+ parts

$63.954

100+ parts

-

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-

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936

$63.954

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-

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Vyrian

USA . 2,223 parts In-Stock

1+ parts

-

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2,223

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 960 parts In-Stock

1+ parts

$21.560

100+ parts

-

1k+ parts

-

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960

$21.560

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-

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Ampacity Inc.

Singapore . 47,586 parts In-Stock

1+ parts

$57.220

100+ parts

-

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47,586

$57.220

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Semicontronic

India . 47,579 parts In-Stock

1+ parts

$57.220

100+ parts

$55.790

1k+ parts

$55.503

10k+ parts

-

47,579

$57.220

$55.790

$55.503

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Corphita

USA . 4,215 parts In-Stock

1+ parts

$60.588

100+ parts

-

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-

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4,215

$60.588

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-

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Corohmni

South Africa . 464 parts In-Stock

1+ parts

$67.320

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464

$67.320

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Microchip USA

USA . 1,560 parts In-Stock

1+ parts

$126.500

100+ parts

$124.300

1k+ parts

$123.200

10k+ parts

$122.100

1,560

$126.500

$124.300

$123.200

$122.100

Northwest PG Solutions

USA . 626 parts In-Stock

1+ parts

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626

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Native Components

USA . 114 parts In-Stock

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114

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Overview

Elevate your projects to the next level with the ADS1285IRHBR Analog-to-Digital Converter by Texas Instruments. Renowned for their high-quality components, Texas Instruments delivers precision and reliability in every product. This converter boasts 32 bits of accuracy and a sample rate of 0.004 MHz, making it ideal for a wide range of applications. Whether you're working on industrial automation or medical devices, this converter offers unmatched performance, value, and efficiency. Choose Texas Instruments for superior quality and unleash the potential of your designs with the ADS1285IRHBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple input sources, making this product suitable for applications requiring multiple inputs.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact and space-constrained environments.

No. of Bits: 32

With 32 bits, this ADC provides high resolution and accuracy in converting analog signals to digital, making it suitable for precise measurements and data acquisition applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can operate reliably in a wide range of environments without overheating.

Technical Specifications

Analog-to-Digital Converters ADS1285IRHBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

32

Output Bit Code:

Binary, 2’s Complement Binary

Output Format:

Serial

Sample Rate:

4 kHz

Electrical Specifications

Minimum Analog Input Voltage:

-2.5 V

Maximum Analog Input Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

1.85 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC32,.2SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Trade Compliance

ADS1285IRHBR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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