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ADS1213EG4

Texas Instruments

ADS1213EG4 by Texas Instruments

The Texas Instruments ADS1213EG4 is a 22-bit ADC with 4 analog input channels, operating at a sample rate of 0.001 MHz. It has a max linearity error of 0.0015% and supports industrial temperature grades. This converter type is ideal for applications requiring precise analog-to-digital conversion in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,902 parts In-Stock

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2,902

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Vyrian

USA . 2,139 parts In-Stock

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2,139

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Chip Stock

USA . 143 parts In-Stock

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143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 32 parts In-Stock

1+ parts

$0.440

100+ parts

-

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-

10k+ parts

$0.422

32

$0.440

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-

$0.422

Northwest PG Solutions

USA . 1,911 parts In-Stock

1+ parts

$0.484

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-

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$0.426

1,911

$0.484

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-

$0.426

Parana Technologies

USA . 1,552 parts In-Stock

1+ parts

$14.515

100+ parts

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$14.955

10k+ parts

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1,552

$14.515

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$14.955

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DigiPath Technology Company

USA . 2,362 parts In-Stock

1+ parts

$15.983

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2,362

$15.983

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ChromeModa Solutions

Germany . 6,647 parts In-Stock

1+ parts

$16.309

100+ parts

$13.373

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6,647

$16.309

$13.373

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

1+ parts

$16.309

100+ parts

$15.494

1k+ parts

$14.678

10k+ parts

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1,541

$16.309

$15.494

$14.678

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AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$19.705

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409

$19.705

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One Stop Electronics

USA . 740 parts In-Stock

1+ parts

$35.000

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740

$35.000

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Component Stockers USA

USA . 298 parts In-Stock

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$99.990

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298

$99.990

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Microchip USA

USA . 3,995 parts In-Stock

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3,995

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Corphita

USA . 2,396 parts In-Stock

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2,396

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Overview

Unlock unparalleled precision and performance with the Texas Instruments ADS1213EG4 Analog-to-Digital Converter. Crafted with top-quality materials and cutting-edge technology, this converter boasts 22 bits of accuracy and a maximum linearity error of just 0.0015%. Perfect for industrial applications requiring high-resolution data acquisition, this small outline, shrink pitch package offers customers unmatched value and reliability. Say goodbye to compromised results and hello to superior quality with the ADS1213EG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, suitable for a variety of applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and productivity.

No. of Bits: 22

With 22 bits of resolution, this ADC provides high precision and accuracy in converting analog signals to digital data.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial environments where temperature fluctuations may occur.

Converter Type: ADC, DELTA-SIGMA

The delta-sigma ADC type ensures high accuracy and low noise in the conversion process, making it ideal for applications requiring precise measurements.

Technical Specifications

Analog-to-Digital Converters ADS1213EG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

22

Sub-Category:

Other Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0015 %

Sample Rate:

1 kHz

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS1213EG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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