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ADS1206IDGKR

Texas Instruments

ADS1206IDGKR by Texas Instruments

ADS1206IDGKR by Texas Instruments is an Analog Special Purpose Converter with 8 terminals, operating at -40 to 85 °C. It features a max linearity error of 0.018%, voltage to frequency conversion, and a supply voltage range of 3-3.6 V. Ideal for industrial applications requiring precise analog signal processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,845 parts In-Stock

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8,845

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Digiode

USA . 4,687 parts In-Stock

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4,687

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Distributors (Availability)

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AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$19.232

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362

$19.232

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Parana Technologies

USA . 1,497 parts In-Stock

1+ parts

$24.786

100+ parts

$2,301.720

1k+ parts

$22.307

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1,497

$24.786

$2,301.720

$22.307

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One Stop Electronics

USA . 824 parts In-Stock

1+ parts

$27.000

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824

$27.000

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DigiPath Technology Company

USA . 1,838 parts In-Stock

1+ parts

$27.292

100+ parts

$25.109

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1,838

$27.292

$25.109

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ChromeModa Solutions

Germany . 1,946 parts In-Stock

1+ parts

$27.849

100+ parts

$22.836

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1,946

$27.849

$22.836

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IDEA Electronic Components Group

UK . 528 parts In-Stock

1+ parts

$27.849

100+ parts

$26.457

1k+ parts

$25.064

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528

$27.849

$26.457

$25.064

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Northwest PG Solutions

USA . 1,983 parts In-Stock

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Native Components

USA . 738 parts In-Stock

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738

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Corphita

USA . 398 parts In-Stock

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398

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Overview

Elevate your analog system performance with the ADS1206IDGKR by Texas Instruments. Designed with precision and reliability in mind, this voltage to frequency converter offers unparalleled accuracy with a maximum linearity error of just 0.018%. Perfect for industrial applications, this compact and versatile converter boasts a wide temperature range and a small outline package shape for seamless integration. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and performance for all your analog special purpose converter needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and resistance to external factors, making the product suitable for a variety of environments.

Surface Mount: YES

The surface mount capability allows for easy integration into compact electronic designs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing versatility in application scenarios.

Package Shape: SQUARE

The square package shape facilitates easy mounting and alignment within circuit layouts, enhancing overall design efficiency.

Maximum Linearity Error (EL): 0.018 %

The low linearity error ensures accurate and reliable voltage to frequency conversion, making the product suitable for precision measurement applications.

No. of Terminals: 8

The ample number of terminals allows for flexible connectivity options and minimizes the need for external components, simplifying circuit design.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making the product suitable for demanding industrial applications.

Converter Type: VOLTAGE TO FREQUENCY CONVERTER

The specific converter type indicates the product's functionality, making it a reliable choice for applications requiring voltage to frequency conversion.

Technical Specifications

Analog Special Purpose Converters ADS1206IDGKR attributes and parameters. Explore more Analog Special Purpose Converters devices from Texas Instruments

Converter Specifications

Maximum Linearity Error (EL):

0.018 %

No. of Functions:

1

Additional Features:

+5V supply also available

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Maximum Positive Input Voltage:

5.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Voltage:

3.6 V

Operating Conditions

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Standards and Codes

Qualification:

Not Qualified

JESD-30 Code:

S-PDSO-G8

Trade Compliance

ADS1206IDGKR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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