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ADS1015QDGSRQ1

Texas Instruments

ADS1015QDGSRQ1 by Texas Instruments

ADS1015QDGSRQ1 by Texas Instruments is a 12-bit ADC with 4 analog input channels. It operates at a max temperature of 125°C and has a sample rate of 0.0033 MHz. This converter is commonly used in automotive applications due to its AEC-Q100 screening level.

Median Price

$5.152

Lifecycle Status

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8

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1k+

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Bristol Electronics

USA . 600 parts In-Stock

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$2.404

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Vyrian

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Digiode

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Cyclops Electronics Ltd

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Huijzer Components

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Vigor

Singapore . 586 parts In-Stock

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AZTECH Wire

Italy . 674 parts In-Stock

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Corohmni

South Africa . 133 parts In-Stock

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Parana Technologies

USA . 870 parts In-Stock

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Semicontronic

India . 313 parts In-Stock

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ChromeModa Solutions

Germany . 3,437 parts In-Stock

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

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Ampacity Inc.

Singapore . 812 parts In-Stock

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One Stop Electronics

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Perfect Parts

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Continental Prestige Electronics

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Argo Parts USA

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A-Z Elektronik GmbH

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DigiPath Technology Company

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Alle Elektronik GmbH

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Microchip USA

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Bastille Electronics

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Overview

Experience the superior quality and performance of the ADS1015QDGSRQ1 Analog-to-Digital Converter by Texas Instruments. As a trusted manufacturer, Texas Instruments brings you cutting-edge technology and reliability. The ADS1015QDGSRQ1 offers unparalleled accuracy and versatility with its 12-bit resolution and four analog input channels. This compact device is perfect for a wide range of applications, including automotive systems. With its high-speed sampling rate and low power consumption, the ADS1015QDGSRQ1 delivers exceptional value and benefits to customers. Upgrade your projects with this innovative solution and unlock new possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, improving efficiency and throughput.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the PCB, making the product suitable for compact designs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making the product suitable for automotive applications where durability is essential.

No. of Bits: 12

With 12 bits of resolution, this product offers high precision and accuracy in converting analog signals to digital data.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

The wide operating temperature range makes this product suitable for use in harsh environments where temperature fluctuations are common.

Converter Type: ADC, DELTA-SIGMA

Using delta-sigma conversion technology ensures high accuracy and low noise in the digital output, making it a reliable choice for precision applications.

Technical Specifications

Analog-to-Digital Converters ADS1015QDGSRQ1 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Other Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0122 %

Sample Rate:

3.3 kHz

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

256 mV

Maximum Analog Input Voltage:

6.144 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP10,.19,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

Qualified:

No

JESD-609 Code:

e4

Screening Level:

AEC-Q100

Trade Compliance

ADS1015QDGSRQ1 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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