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ADC14C105EB/NOPB

Texas Instruments

ADC14C105EB/NOPB by Texas Instruments

Texas Instruments' ADC14C105EB/NOPB is a 14-bit ADC Evaluation Board with 105MSPS sampling rate and 2Vpp input range. It utilizes the ADC14C105 IC, consuming 400mW @ 105MSPS. Ideal for Development Boards, Kits, and Analog to Digital Converters applications.

Median Price

$422.190

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

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$422.190

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$422.190

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Distributors (In-Stock)

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Digiode

USA . 1,986 parts In-Stock

1+ parts

$414.314

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1,986

$414.314

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Vyrian

USA . 7,284 parts In-Stock

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7,284

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$370.700

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1

$370.700

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Semicontronic

India . 1 parts In-Stock

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$370.700

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$361.432

1k+ parts

$359.579

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1

$370.700

$361.432

$359.579

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Corphita

USA . 4,061 parts In-Stock

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$392.508

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4,061

$392.508

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Corohmni

South Africa . 365 parts In-Stock

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$436.120

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365

$436.120

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ChromeModa Solutions

Germany . 4,166 parts In-Stock

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DigiPath Technology Company

USA . 1,990 parts In-Stock

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1,990

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IDEA Electronic Components Group

UK . 1,893 parts In-Stock

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Northwest PG Solutions

USA . 1,505 parts In-Stock

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Parana Technologies

USA . 1,307 parts In-Stock

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$0.020

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1,307

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$0.020

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Native Components

USA . 537 parts In-Stock

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537

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Experience unparalleled quality with the ADC14C105EB/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this Analog to Digital Converter Evaluation Board for various applications. Offering a sampling rate of 105M per second and an input range of 2Vpp, this board provides exceptional value and performance. Whether you are developing new projects or evaluating existing systems, this product will surely meet your needs with its high-quality design and reliable functionality. Elevate your projects with the ADC14C105EB/NOPB today!

Feature Benefit Bullets

Number of Bits: 14

Higher number of bits allows for more accurate and precise conversion of analog signals to digital, resulting in high quality data acquisition.

Sampling Rate (Per Second): 105M

The high sampling rate of 105M per second allows for fast and efficient conversion of analog signals to digital, making this product suitable for applications requiring real-time data processing.

Data Interface: Parallel

Parallel data interface allows for high-speed data transfer between the ADC and other components, enabling quick and efficient communication within the system.

Input Range: 2Vpp

The wide input range of 2Vpp accommodates a variety of input signal levels, making this product versatile and suitable for different signal processing applications.

Power (Typ) @ Conditions: 400mW @ 105MSPS

The low power consumption of 400mW at the high sampling rate of 105MSPS ensures efficient energy usage, making this product suitable for portable and power-sensitive applications.

Technical Specifications

Additional Parts ADC14C105EB/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

ADC14C105EB
ADC14C105EB-ND
ADC14C105EBNOPB

Category:

Development Boards, Kits, Programmers
Evaluation Boards Analog to Digital Converters (ADCs) Evaluation Boards

Number of A/D Converters:

1

Data Interface:

Parallel

Standard Package:

1

Supplied Contents:

Board(s)

Input Range:

2Vpp

Number of Bits:

14

Utilized IC / Part:

ADC14C105

Package:

Box

Sampling Rate (Per Second):

105M

Power (Typ) @ Conditions:

400mW @ 105MSPS

Base Product Number:

ADC14C

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

ADC14C105EB/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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