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ADC12QJ1600ALREP

Texas Instruments

ADC12QJ1600ALREP by Texas Instruments

ADC12QJ1600ALREP by Texas Instruments is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 1600 MHz. It features a max linearity error of 0.047607% and is ideal for applications requiring high-speed and accurate analog-to-digital conversion in compact electronic devices.

Median Price

$1,477.200

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,274 parts In-Stock

1+ parts

$1,477.200

100+ parts

$1,354.100

1k+ parts

$1,231.000

10k+ parts

-

3,274

$1,477.200

$1,354.100

$1,231.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,893 parts In-Stock

1+ parts

$1,403.340

100+ parts

-

1k+ parts

-

10k+ parts

-

2,893

$1,403.340

-

-

-

Vyrian

USA . 3,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,570

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,367 parts In-Stock

1+ parts

$1.000

100+ parts

$869.950

1k+ parts

$847.060

10k+ parts

$824.170

2,367

$1.000

$869.950

$847.060

$824.170

Native Components

USA . 610 parts In-Stock

1+ parts

$8.343

100+ parts

-

1k+ parts

-

10k+ parts

-

610

$8.343

-

-

-

Northwest PG Solutions

USA . 1,859 parts In-Stock

1+ parts

$9.178

100+ parts

$8.260

1k+ parts

-

10k+ parts

-

1,859

$9.178

$8.260

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-

Semicontronic

India . 1,226 parts In-Stock

1+ parts

$1,255.620

100+ parts

$1,224.230

1k+ parts

$1,217.951

10k+ parts

-

1,226

$1,255.620

$1,224.230

$1,217.951

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Ampacity Inc.

Singapore . 1,154 parts In-Stock

1+ parts

$1,255.620

100+ parts

-

1k+ parts

-

10k+ parts

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1,154

$1,255.620

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-

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Corphita

USA . 4,690 parts In-Stock

1+ parts

$1,329.480

100+ parts

-

1k+ parts

-

10k+ parts

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4,690

$1,329.480

-

-

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Corohmni

South Africa . 422 parts In-Stock

1+ parts

$1,477.200

100+ parts

-

1k+ parts

-

10k+ parts

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422

$1,477.200

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-

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Overview

Experience superior quality and precision with the ADC12QJ1600ALREP by Texas Instruments, a leading manufacturer in analog-to-digital converters. Perfect for a wide range of applications, this product offers unmatched value and benefits to customers seeking high performance and reliability. With its 12-bit resolution and 1600 MHz sample rate, this converter ensures accurate data conversion and seamless operation. Trust Texas Instruments for innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it easy to handle and ensuring long-term reliability.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple inputs to be converted simultaneously, providing flexibility and efficiency in data acquisition processes.

Surface Mount: YES

Being surface mountable makes the product suitable for compact electronic designs and automated assembly processes, saving space and reducing production costs.

No. of Bits: 12

With 12 bits resolution, the product offers high precision and accuracy in converting analog signals to digital data, ensuring reliable performance in various applications.

Maximum Linearity Error (EL): 0.047607 %

The low linearity error percentage ensures accurate and consistent conversion of analog signals, making the product suitable for high-precision measurement and control applications.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options and ease of integration with other components in the system, enhancing the product's compatibility and usability.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high-density mounting and efficient signal routing, optimizing board space usage and enhancing overall system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable operation in harsh environments and temperature fluctuations, making the product suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range allows the product to operate in cold environments without performance degradation, offering versatility and reliability in various operating conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and conductivity, ensuring secure connections and signal integrity in the product, enhancing overall performance and reliability.

Terminal Position: BOTTOM

Having bottom terminal positioning simplifies the PCB layout and assembly process, making it easy to integrate the product into different electronic systems, reducing manufacturing complexities.

Maximum Seated Height: 1.91 mm

The low maximum seated height profile allows for compact and slim designs, making the product suitable for space-constrained applications where size and form factor are critical factors.

Width: 10 mm

The compact width dimension provides flexibility in PCB layout and design, enabling easy integration of the product into various electronic systems with limited space constraints.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance ensures reliable soldering during assembly processes, making the product suitable for automated manufacturing and rework operations.

Length: 10 mm

The compact length dimension offers design flexibility and compatibility in space-limited applications, allowing for easy integration and installation of the product in electronic systems.

Maximum Analog Input Voltage: 0.8 V

The high maximum analog input voltage capability allows for compatibility with a wide range of signal sources, ensuring versatility and adaptability in different applications.

Sample Rate: 1600 MHz

The high sample rate enables fast and accurate data conversion, making the product suitable for real-time signal processing and high-speed data acquisition applications.

Terminal Form: BALL

The ball terminal form facilitates secure and reliable connections, ensuring stable signal transmission and reducing the risk of signal loss or interference in the product, enhancing overall performance.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high-speed and high-resolution conversion capability, making the product suitable for demanding applications that require quick and precise data acquisition.

Nominal Supply Voltage: 1.1 V

The low nominal supply voltage requirement reduces power consumption and heat dissipation, making the product energy-efficient and suitable for battery-powered or low-power applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Supporting offset binary and two's complement binary output bit codes provides compatibility with different data processing systems, ensuring seamless integration and data interchangeability.

Terminal Pitch: 0.8 mm

Having a small terminal pitch allows for high-density mounting and efficient signal routing on the PCB, optimizing board space usage and enhancing overall system performance.

Minimum Analog Input Voltage: -0.8 V

The low minimum analog input voltage tolerance enables compatibility with a wide range of signal sources, ensuring flexibility and adaptability in various input signal conditions.

Output Format: SERIAL

The serial output format simplifies data transmission and processing, making it easy to interface the product with digital systems or microcontrollers for further data analysis and manipulation.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the product's resistance to moisture-related failures during storage or operation, ensuring long-term reliability and performance in humid environments.

Technical Specifications

Analog-to-Digital Converters ADC12QJ1600ALREP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.047607 %

Sample Rate:

1600 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-800 mV

Maximum Analog Input Voltage:

800 mV

Nominal Supply Voltage:

1.1 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

235 °C (455 °F)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.075 in (1.91 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA144,12X12,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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