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ADC12J1600NKE10

Texas Instruments

ADC12J1600NKE10 by Texas Instruments

ADC, PROPRIETARY METHOD; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: VQCCN; Package Shape: SQUARE;

Median Price

$1,423.388

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

$1,138.710

100+ parts

$1,070.390

1k+ parts

$1,002.060

10k+ parts

-

40

$1,138.710

$1,070.390

$1,002.060

-

Verical

USA . 40 parts In-Stock

1+ parts

$1,423.388

100+ parts

$1,337.987

1k+ parts

$1,252.575

10k+ parts

-

40

$1,423.388

$1,337.987

$1,252.575

-

DigiKey

USA . 40 parts In-Stock

1+ parts

$1,423.390

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$1,423.390

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

$899.200

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$899.200

-

-

-

Digiode

USA . 2,746 parts In-Stock

1+ parts

$1,256.062

100+ parts

-

1k+ parts

-

10k+ parts

-

2,746

$1,256.062

-

-

-

Vyrian

USA . 7,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,559

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Dan-Mar Components

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 924 parts In-Stock

1+ parts

$1.412

100+ parts

-

1k+ parts

-

10k+ parts

-

924

$1.412

-

-

-

Northwest PG Solutions

USA . 2,166 parts In-Stock

1+ parts

$1.553

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

$1.553

-

-

-

Andel Nordic

Denmark . 601 parts In-Stock

1+ parts

$8.657

100+ parts

-

1k+ parts

$8.311

10k+ parts

$8.311

601

$8.657

-

$8.311

$8.311

Parana Technologies

USA . 2,188 parts In-Stock

1+ parts

$18.291

100+ parts

-

1k+ parts

$18.425

10k+ parts

-

2,188

$18.291

-

$18.425

-

DigiPath Technology Company

USA . 1,202 parts In-Stock

1+ parts

$20.141

100+ parts

$18.530

1k+ parts

-

10k+ parts

-

1,202

$20.141

$18.530

-

-

ChromeModa Solutions

Germany . 6,330 parts In-Stock

1+ parts

$20.552

100+ parts

$16.853

1k+ parts

-

10k+ parts

-

6,330

$20.552

$16.853

-

-

IDEA Electronic Components Group

UK . 1,972 parts In-Stock

1+ parts

$20.552

100+ parts

$19.524

1k+ parts

$18.497

10k+ parts

-

1,972

$20.552

$19.524

$18.497

-

Microchip USA

USA . 1,744 parts In-Stock

1+ parts

$649.820

100+ parts

$617.330

1k+ parts

$601.080

10k+ parts

$584.840

1,744

$649.820

$617.330

$601.080

$584.840

Corphita

USA . 57 parts In-Stock

1+ parts

$1,189.953

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$1,189.953

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Technical Specifications

Analog-to-Digital Converters ADC12J1600NKE10 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

2700 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-950 mV

Maximum Analog Input Voltage:

950 mV

Nominal Supply Voltage:

1.2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

68

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Style:

Chip Carrier, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N68

Trade Compliance

ADC12J1600NKE10 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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