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ADC12DJ3200ZEGT

Texas Instruments

ADC12DJ3200ZEGT by Texas Instruments

Texas Instruments' ADC12DJ3200ZEGT is a 12-bit ADC with a sample rate of 6400 MHz, ideal for industrial applications. It features a max analog input voltage of 1.04V and output in serial format. The package style is grid array with fine pitch, making it suitable for surface mount assembly.

Median Price

$1,603.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,045 parts In-Stock

1+ parts

$1,603.200

100+ parts

$1,469.600

1k+ parts

$1,336.000

10k+ parts

-

1,045

$1,603.200

$1,469.600

$1,336.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,795 parts In-Stock

1+ parts

$1,523.040

100+ parts

-

1k+ parts

-

10k+ parts

-

3,795

$1,523.040

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2,479.940

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$2,479.940

-

-

-

Vyrian

USA . 5,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,272

-

-

-

-

Chip Stock

USA . 175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

175

-

-

-

-

VNN

France . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,876 parts In-Stock

1+ parts

$1.000

100+ parts

$1.000

1k+ parts

$1.000

10k+ parts

$1.000

1,876

$1.000

$1.000

$1.000

$1.000

AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$11.920

100+ parts

-

1k+ parts

-

10k+ parts

-

754

$11.920

-

-

-

Parana Technologies

USA . 654 parts In-Stock

1+ parts

$12.044

100+ parts

-

1k+ parts

$12.450

10k+ parts

-

654

$12.044

-

$12.450

-

DigiPath Technology Company

USA . 609 parts In-Stock

1+ parts

$13.262

100+ parts

-

1k+ parts

-

10k+ parts

-

609

$13.262

-

-

-

ChromeModa Solutions

Germany . 5,723 parts In-Stock

1+ parts

$13.533

100+ parts

$11.097

1k+ parts

-

10k+ parts

-

5,723

$13.533

$11.097

-

-

IDEA Electronic Components Group

UK . 1,921 parts In-Stock

1+ parts

$13.533

100+ parts

$12.856

1k+ parts

$12.180

10k+ parts

-

1,921

$13.533

$12.856

$12.180

-

Ampacity Inc.

Singapore . 607 parts In-Stock

1+ parts

$1,362.720

100+ parts

-

1k+ parts

-

10k+ parts

-

607

$1,362.720

-

-

-

Corphita

USA . 1,801 parts In-Stock

1+ parts

$1,442.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

$1,442.880

-

-

-

Continental Prestige Electronics

USA . 6,477 parts In-Stock

1+ parts

$2,479.940

100+ parts

-

1k+ parts

-

10k+ parts

$2,430.341

6,477

$2,479.940

-

-

$2,430.341

Argo Parts USA

USA . 3,585 parts In-Stock

1+ parts

$2,479.940

100+ parts

$2,455.141

1k+ parts

$2,430.341

10k+ parts

$2,405.542

3,585

$2,479.940

$2,455.141

$2,430.341

$2,405.542

Overview

Experience the superior quality and precision of the Texas Instruments ADC12DJ3200ZEGT Analog-to-Digital Converter. Designed by a trusted manufacturer, this product offers unmatched reliability and performance in a wide range of applications. With advanced features and benefits, including high-resolution conversion and fast sample rates, this converter delivers exceptional value to customers seeking top-notch digital signal processing. Upgrade your system with the ADC12DJ3200ZEGT and elevate your projects to new heights of efficiency and accuracy.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on a PCB.

No. of Bits: 12

High number of bits results in greater resolution and accuracy of the analog-to-digital conversion.

No. of Terminals: 144

Large number of terminals provide versatility and flexibility in connectivity options.

Maximum Operating Temperature: 85 °C

Wide range of operating temperature ensures stability and performance in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures stability and performance in varying environmental conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead finish provides good solderability and conductivity for reliable connections.

Maximum Analog Input Voltage: 1.04 V

High maximum analog input voltage allows for a wide range of input signals to be accurately converted.

Sample Rate: 6400 MHz

High sample rate ensures real-time and accurate conversion of analog signals.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Technical Specifications

Analog-to-Digital Converters ADC12DJ3200ZEGT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Sample Rate:

6400 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.04 V

Maximum Analog Input Voltage:

1.04 V

Nominal Supply Voltage:

1.1 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

235 °C (455 °F)

Maximum Time At Peak Reflow Temperature:

20 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Trade Compliance

ADC12DJ3200ZEGT Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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