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ADC12D1620LGMPR

Texas Instruments

ADC12D1620LGMPR by Texas Instruments

Texas Instruments' ADC12D1620LGMPR is a 12-bit ADC with 2 analog in channels, 1600 MHz sample rate, and 0.1831% max linearity error. Ideal for applications requiring high-speed data conversion like radar systems or communication equipment.

Median Price

$6,502.720

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 43 parts In-Stock

1+ parts

$6,502.720

100+ parts

$5,806.000

1k+ parts

-

10k+ parts

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43

$6,502.720

$5,806.000

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 661 parts In-Stock

1+ parts

$6,177.584

100+ parts

-

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-

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661

$6,177.584

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Vyrian

USA . 6,883 parts In-Stock

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6,883

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,067 parts In-Stock

1+ parts

$6.054

100+ parts

-

1k+ parts

$6.832

10k+ parts

-

1,067

$6.054

-

$6.832

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DigiPath Technology Company

USA . 388 parts In-Stock

1+ parts

$6.666

100+ parts

-

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388

$6.666

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ChromeModa Solutions

Germany . 380 parts In-Stock

1+ parts

$6.802

100+ parts

$5.578

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-

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380

$6.802

$5.578

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IDEA Electronic Components Group

UK . 155 parts In-Stock

1+ parts

$6.802

100+ parts

-

1k+ parts

$6.122

10k+ parts

-

155

$6.802

-

$6.122

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AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$12.280

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-

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576

$12.280

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Corphita

USA . 1,672 parts In-Stock

1+ parts

$5,852.448

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1,672

$5,852.448

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Microchip USA

USA . 2,533 parts In-Stock

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2,533

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Northwest PG Solutions

USA . 1,100 parts In-Stock

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1,100

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Native Components

USA . 467 parts In-Stock

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467

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Overview

Experience unparalleled precision and reliability with the Texas Instruments ADC12D1620LGMPR Analog-to-Digital Converter. As a leading manufacturer in the industry, Texas Instruments delivers top-quality components for a wide range of applications. This cutting-edge converter boasts a 12-bit resolution and a sample rate of 1600 MHz, ensuring accurate and efficient performance. With a compact square package and surface mount capability, this converter is suitable for various electronic systems. Trust in Texas Instruments to provide innovative solutions that meet your specific needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and protection for the internal components of the analog-to-digital converter.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatility in data acquisition and conversion, making this converter suitable for various applications.

No. of Bits: 12

With 12 bits, this converter offers high resolution and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.1831%

The low maximum linearity error ensures precision in the conversion process, resulting in accurate digital output.

Technology: CMOS

The CMOS technology used in this converter provides low power consumption and high speed operation, making it efficient for different electronic systems.

Output Format: SERIAL

The serial output format allows for easy integration with other digital systems and devices, enhancing compatibility and connectivity.

Technical Specifications

Analog-to-Digital Converters ADC12D1620LGMPR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1831 %

Sample Rate:

1600 MHz

Hold Mode:

Track

Electrical Specifications

Minimum Analog Input Voltage:

-800 mV

Maximum Analog Input Voltage:

800 mV

Nominal Supply Voltage:

1.9 V

Maximum Supply Current:

6 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Total Ionizing Dose:

300k Rad(Si)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

256

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

1.1 in (27.94 mm)

Length:

1.1 in (27.94 mm)

Maximum Seated Height:

0.163 in (4.13 mm)

Packaging

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style:

Grid Array

Package Shape:

Package Code:

LGA

Standards and Codes

JESD-30 Code:

S-CBGA-B256

Trade Compliance

ADC12D1620LGMPR Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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